Inventor
Keisuke Namiki
Inventor
Tokyo, JP
Overview
Patents· 38 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing35%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1032%
LOC1321%
H01LSemiconductor devices5%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form2%
C25DProcesses for the electrolytic or electrophoretic production of coatings2%
G05BControl or regulating systems in general2%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h102%
Y10TTechnical subjects covered by former us classification2%
PatentTitleYear
11,088,011Elastic membrane, substrate holding device, and polishing apparatus202110,702,972Polishing apparatus202010,464,185Substrate polishing method, top ring, and substrate polishing apparatus201910,442,056Substrate holding apparatus and polishing apparatus2019D0859332Elastic membrane for semiconductor wafer polishing201910,391,603Polishing apparatus, control method and recording medium201910,213,896Elastic membrane, substrate holding apparatus, and polishing apparatus2019D0839224Elastic membrane for semiconductor wafer polishing20199,999,956Polishing device and polishing method2018D0813180'Elastic membrane for semiconductor wafer polishing apparatus'2018D0808349'Elastic membrane for semiconductor wafer polishing apparatus'20189,815,171'Substrate holder, polishing apparatus, polishing method, and retaining ring'2017D0799437'Substrate retaining ring'2017D0794585'Retainer ring for substrate'2017D0793976'Substrate retaining ring'20179,676,076'Polishing method and polishing apparatus'20179,662,764'Substrate holder, polishing apparatus, and polishing method'20179,573,241'Polishing apparatus and polishing method'20179,573,244'Elastic membrane, substrate holding apparatus, and polishing apparatus'2017D0770990'Elastic membrane for semiconductor wafer polishing apparatus'2016D0769200'Elastic membrane for semiconductor wafer polishing apparatus'2016D0766849'Substrate retaining ring'20169,403,255'Polishing apparatus and polishing method'2016D0729753'Elastic membrane for semiconductor wafer polishing'20158,870,625'Method and apparatus for dressing polishing pad, profile measuring method, substrate polishing apparatus, and substrate polishing method'20148,859,070'Elastic membrane'2014D0711330'Elastic membrane for semiconductor wafer polishing'2014D0634719'Elastic membrane for semiconductor wafer polishing apparatus'20117,901,550'Plating apparatus'2011D0633452'Elastic membrane for semiconductor wafer polishing apparatus'20117,897,007'Substrate holding apparatus and substrate polishing apparatus'20117,850,509'Substrate holding apparatus'20107,491,117'Substrate holding apparatus'20097,156,725'Substrate polishing machine'20077,083,507'Substrate holding apparatus'20066,890,402'Substrate holding apparatus and substrate polishing apparatus'20056,852,019'Substrate holding apparatus'20055,651,724'Method and apparatus for polishing workpiece'1997Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1997–2021Patents assigned to EBARA CORP (37)· patent assignee history
1997–2010Based in Fujisawa, JP· patent location history
2005–2011Based in Kanagawa, JP· patent location history
2011–2021Based in Tokyo, JP· patent location history
2011Based in Saitama-shi, JP· patent location history
2014Patents assigned to NAMIKI KEISUKE (2)· patent assignee history
2014Patents assigned to FUKUSHIMA MAKOTO (1)· patent assignee history
2014Patents assigned to NABEYA OSAMU (1)· patent assignee history
2014Patents assigned to TOGAWA TETSUJI (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| EBARA CORP | 37 | 1997–2021 |
| NAMIKI KEISUKEself | 2 | 2014 |
| FUKUSHIMA MAKOTO | 1 | 2014 |
| NABEYA OSAMU | 1 | 2014 |
| TOGAWA TETSUJI | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 28 | 2011–2021 |
| Fujisawa, JP | 5 | 1997–2010 |
| Kanagawa, JP | 3 | 2005–2011 |
| Saitama-shi, JP | 2 | 2011 |