USPatentGranted
S1

Elastic membrane for semiconductor wafer polishing

Granted 19 May 2015 · no office action yet

Assignee: Ebara Corporation

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Attorney: Attorney · Log in to unlock

Inventors: Hozumi Yasuda, Katsuhide Watanabe, Osamu Nabeya, Keisuke Namiki +1 · Examiner: Selina Sikder · AU 2912 · TC 2900

Application
29/496,207
filed 10 Jul 2014
Publication
Not published
not published
Patent· this page
US D729753
granted 19 May 2015

Life of the patent

4 dated events
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Description

1 parts
›FIG. 1 is a front view of an…

FIG. 1 is a front view of an elastic membrane for semiconductor wafer polishing showing our new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a bottom view thereof;

FIG. 4 is a plan view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a right side view thereof;

FIG. 7 is a cross-section view taken along the line 7 - 7 of FIG. 2 thereof;

FIG. 8 is a enlarged view of part 8 of FIG. 7 thereof; and,

FIG. 9 is a enlarged perspective view, observed from above thereof.

The broken lines depict environmental subject matter only and form no part of the claimed design.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims

1 · 1 independent · depth 1
1 granted claims

Classifications

1 codes
USPC · US Patent Classification
D13/182

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File wrapper

⤢ drag to zoomJul 2014Oct 2014Jan 2015Apr 2015Jul 2015USPTOApplicantNotice of allowance
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Pendency
0.9 y
313 days filing → grant
Office actions
0
none on record
Examiner
Selina Sikder
art unit 2912 · TC 2900
Citations: 87 back · 0 forward

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Citations

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