LexDanaLexDanabeta
Inventor

Makoto Fukushima

Inventor
Tokyo, JP

Overview

78→
Patents
1993–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 78 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B24Bprimary
B24BMachines, devices, or processes for grinding or polishing36%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1034%
LOC1310%
H01LSemiconductor devices4%
B43KImplements for writing or drawing4%
H01JElectric discharge tubes or discharge lamps2%
H05KPrinted circuits2%
Y10TTechnical subjects covered by former us classification1%
A61KPreparations for medical, dental or toiletry purposes1%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form1%
PatentTitleYear
10,702,972Polishing apparatus202010,537,975Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus202010,486,284Substrate holding device, and substrate polishing apparatus201910,464,185Substrate polishing method, top ring, and substrate polishing apparatus201910,442,056Substrate holding apparatus and polishing apparatus201910,414,015Polishing apparatus and polishing method2019D0859332Elastic membrane for semiconductor wafer polishing201910,391,603Polishing apparatus, control method and recording medium201910,307,882Method and apparatus for polishing a substrate201910,293,455Polishing apparatus201910,213,896Elastic membrane, substrate holding apparatus, and polishing apparatus2019D0839224Elastic membrane for semiconductor wafer polishing201910,092,992Polishing apparatus, polishing head, and retainer ring201810,040,166Polishing apparatus201810,035,239Polishing apparatus, polishing head, and retainer ring20189,999,956Polishing device and polishing method2018D0813180'Elastic membrane for semiconductor wafer polishing apparatus'20189,884,401'Elastic membrane and substrate holding apparatus'2018D0808349'Elastic membrane for semiconductor wafer polishing apparatus'20189,815,171'Substrate holder, polishing apparatus, polishing method, and retaining ring'2017D0799437'Substrate retaining ring'2017D0794585'Retainer ring for substrate'20179,724,797'Polishing apparatus'2017D0793976'Substrate retaining ring'20179,662,764'Substrate holder, polishing apparatus, and polishing method'20179,573,241'Polishing apparatus and polishing method'20179,573,244'Elastic membrane, substrate holding apparatus, and polishing apparatus'20179,550,271'Substrate holding apparatus and polishing apparatus'2017D0770990'Elastic membrane for semiconductor wafer polishing apparatus'2016D0769200'Elastic membrane for semiconductor wafer polishing apparatus'2016D0766849'Substrate retaining ring'20169,403,255'Polishing apparatus and polishing method'20169,399,277'Polishing apparatus and polishing method'20169,308,621'Method and apparatus for polishing a substrate'20169,149,903'Polishing apparatus having substrate holding apparatus'20159,073,170'Polishing apparatus having thermal energy measuring means'2015D0729753'Elastic membrane for semiconductor wafer polishing'20158,932,106'Polishing apparatus having thermal energy measuring means'20158,859,070'Elastic membrane'20148,845,396'Polishing apparatus'2014D0711330'Elastic membrane for semiconductor wafer polishing'20148,485,866'Substrate holding apparatus, polishing apparatus, and polishing method'20138,430,716'Polishing method and polishing apparatus'20138,357,029'Polishing apparatus'20138,267,746'Substrate holding apparatus, polishing apparatus, and polishing method'20128,100,743'Polishing apparatus'20128,100,739'Substrate holding apparatus, polishing apparatus, and polishing method'20128,083,571'Polishing apparatus'20118,070,560'Polishing apparatus and method'20117,988,537'Substrate holding apparatus and polishing apparatus'20117,967,665'Substrate holding apparatus, polishing apparatus, and polishing method'2011D0634719'Elastic membrane for semiconductor wafer polishing apparatus'2011D0633452'Elastic membrane for semiconductor wafer polishing apparatus'20117,867,063'Substrate holding apparatus and polishing apparatus'20117,850,509'Substrate holding apparatus'20107,754,365'Membrane electrode assembly, method for manufacturing the same, and fuel cell including the same'20107,635,292'Substrate holding device and polishing apparatus'20097,632,173'Substrate holding apparatus and polishing apparatus'20097,491,117'Substrate holding apparatus'20097,357,699'Substrate holding apparatus and polishing apparatus'20087,311,585'Substrate holding apparatus and polishing apparatus'20077,163,895'Polishing method'20077,156,725'Substrate polishing machine'20077,108,592'Substrate holding apparatus and polishing apparatus'20067,083,507'Substrate holding apparatus'20067,033,260'Substrate holding device and polishing device'20066,852,019'Substrate holding apparatus'20056,755,587'Direct-feed ballpoint writing implement'20046,621,217'Wiring substrate and gas discharge display device'20036,599,046'Direct liquid type writing instrument'20036,346,772'Wiring substrate and gas discharge display device that includes a dry etched layer wet-etched first or second electrodes'20026,261,144'Wiring substrate and gas discharge display device and method therefor'20016,220,774'Ballpoint tip for ballpoint liquid container'20016,204,681'IC device contactor'20015,868,512'Writing instrument with check valve means'19995,762,435'Cap for writing instrument'19985,667,762'Method for preventing adhesion of thallium 201 to container'19975,208,079'Process for improving the resistance to corrosion of stainless steel'1993

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1998–2004Based in Kawagoe, JP· patent location history
2001–2010Based in Yokohama, JP· patent location history
2005–2020Patents assigned to EBARA CORP (64)· patent assignee history
2006–2020Based in Tokyo, JP· patent location history
2010Based in Saitama, JP· patent location history
2011–2016Patents assigned to FUKUSHIMA MAKOTO (12)· patent assignee history
2011–2016Patents assigned to TOGAWA TETSUJI (10)· patent assignee history
2011–2015Patents assigned to YASUDA HOZUMI (10)· patent assignee history
2011–2014Patents assigned to NABEYA OSAMU (9)· patent assignee history
2011Based in Saitama-shi, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
EBARA CORP642005–2020
FUKUSHIMA MAKOTOself122011–2016
TOGAWA TETSUJI102011–2016
YASUDA HOZUMI102011–2015
NABEYA OSAMU92011–2014
Locations
LocationPatentsSpan
Tokyo, JP592006–2020
Yokohama, JP72001–2010
Kawagoe, JP51998–2004
Saitama-shi, JP22011
Saitama, JP12010