LexDanaLexDanabeta
Inventor

Naohide Takamoto

Inventor
Osaka, JP

Overview

52→
Patents
2009–2019
Patent span
Electricity
Primary field (CPC H)

Patents· 52 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1024%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1023%
Y10TTechnical subjects covered by former us classification19%
C09JAdhesives12%
H01LSemiconductor devices12%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form3%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients3%
C08LCompositions of macromolecular compounds2%
C09DCoating compositions, e.g. paints, varnishes or lacquers2%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds1%
PatentTitleYear
10,211,083Film for flip chip type semiconductor back surface and its use201910,141,217Dicing-tape integrated film for backside of semiconductor and method of manufacturing semiconductor device201810,014,235Underfill material, laminated sheet and method for producing semiconductor device20189,911,683'Film for back surface of flip-chip semiconductor'20189,768,050'Film for semiconductor back surface and its use'20179,761,475'Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production'20179,679,797'Dicing-tape integrated film for backside of semiconductor and method of manufacturing semiconductor device'20179,620,403'Adhesive sheet used in manufacture of semiconductor device, adhesive sheet integrated with dicing tape, semiconductor device, and method of manufacturing semiconductor device'20179,478,454'Dicing tape-integrated film for semiconductor back surface'20169,472,439'Reinforcing sheet and method for producing secondary mounted semiconductor device'20169,368,421'Under-fill material and method for producing semiconductor device'20169,362,156'Dicing tape-integrated film for semiconductor back surface'20169,324,616'Method of manufacturing flip-chip type semiconductor device'20169,293,387'Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device'20169,279,064'Manufacturing semiconductor device with film for forming protective layer'20169,202,795'Laminated film and use thereof'20159,196,533'Film for back surface of flip-chip semiconductor, dicing-tape-integrated film for back surface of semiconductor, process for producing semiconductor device, and flip-chip semiconductor device'20159,085,685'Under-fill material and method for producing semiconductor device'20159,074,113'Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device'20159,050,773'Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device'20159,035,466'Dicing tape-integrated film for semiconductor back surface'20158,986,486'Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production'20158,912,665'Dicing tape-integrated film for semiconductor back surface'20148,896,134'Film for back surface of flip-chip semiconductor'20148,841,780'Dicing tape-integrated wafer back surface protective film'20148,810,044'Dicing tape-integrated wafer back surface protective film'20148,766,462'Dicing tape-integrated wafer back surface protective film'20148,722,517'Dicing tape-integrated film for semiconductor back surface'20148,703,584'Dicing tape-integrated film for semiconductor back surface'20148,704,382'Film for flip chip type semiconductor back surface'20148,698,324'Dicing tape-integrated film for semiconductor back surface'20148,692,389'Dicing tape-integrated film for semiconductor back surface'20148,679,931'Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device'20148,652,938'Thermally releasable sheet-integrated film for semiconductor back surface, method of collecting semiconductor element, and method of producing semiconductor device'20148,647,956'Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device'20148,648,476'Dicing tape-integrated wafer back surface protective film'20148,643,194'Dicing tape-integrated film for semiconductor back surface'20148,558,397'Dicing tape-integrated wafer back surface protective film'20138,518,745'Method of manufacturing semiconductor device having a bumped wafer and protective layer'20138,513,816'Film for flip chip type semiconductor back surface containing thermoconductive filler'20138,492,907'Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device'20138,455,302'Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device'20138,450,189'Film for flip chip type semiconductor back surface'20138,420,510'Method of manufacturing semiconductor device'20138,420,509'Film for flip chip type semiconductor back surface'20138,415,201'Dicing tape-integrated film for semiconductor back surface'20138,404,522'Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device'20138,269,213'Epoxy resin composition for semiconductor encapsulation and semiconductor device produced by using the same'20128,237,294'Dicing tape-integrated wafer back surface protective film'20127,829,441'Thermosetting die-bonding film'20107,611,926'Thermosetting die bonding film'2009D0589473'Adhesive film material for use in manufacturing semiconductors'2009

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2009–2019Patents assigned to NITTO DENKO CORP (48)· patent assignee history
2009–2018Based in Ibaraki, JP· patent location history
2012–2018Patents assigned to TAKAMOTO NAOHIDE (26)· patent assignee history
2012–2015Patents assigned to MATSUMURA TAKESHI (7)· patent assignee history
2013–2018Patents assigned to SHIGA GOJI (18)· patent assignee history
2013–2016Patents assigned to ASAI FUMITERU (12)· patent assignee history
2013–2019Based in Osaka, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
NITTO DENKO CORP482009–2019
TAKAMOTO NAOHIDEself262012–2018
SHIGA GOJI182013–2018
ASAI FUMITERU122013–2016
MATSUMURA TAKESHI72012–2015
Locations
LocationPatentsSpan
Osaka, JP292013–2019
Ibaraki, JP232009–2018