Adhesive film material for use in manufacturing semiconductors

FIG. 1 is a perspective view of a first embodiment of the adhesive film material for use in manufacturing semiconductors showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a plan view thereof;

FIG. 4 is a right side view, the left side being a mirror image thereof;

FIG. 5 is an enlarged plan view of the design as identified by A and B in FIG. 2 ;

FIG. 6 is a sectional view taken along line 6 — 6 in FIG. 5 ;

FIG. 7 is a sectional view taken along line 7 — 7 in FIG. 5 ;

FIG. 8 is a perspective view of a second embodiment of the adhesive film material for use in manufacturing semiconductors;

FIG. 9 is a front view thereof;

FIG. 10 is a plan view thereof;

FIG. 11 is a right side view, the left side being a mirror image thereof;

FIG. 12 is an enlarged plan view of the design as identified by A and B in FIG. 9 ;

FIG. 13 is a sectional view taken along line 13 — 13 in FIG. 12 ;

FIG. 14 is a sectional view taken along line 14 — 14 in FIG. 12 ;

FIG. 15 is a perspective view of a third embodiment of the adhesive film material for use in manufacturing semiconductors;

FIG. 16 is a front view thereof;

FIG. 17 is a plan view thereof;

FIG. 18 is a right side view, the left side being a mirror image thereof;

FIG. 19 is an enlarged plan view of the design as identified by A and B in FIG. 16 ;

FIG. 20 is a sectional view taken along line 20 — 20 in FIG. 19 ; and,

FIG. 21 is a sectional view taken along line 21 — 21 in FIG. 19 .