Dicing tape-integrated wafer back surface protective film
Granted 19 Aug 2014 · 2 office actions
Current assignee: Nitto Denko Corporation · originally Nitto Denko
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Attorney: Attorney · Log in to unlock
Inventors: Takeshi Matsumura, Naohide Takamoto · Examiner: Sheila V Clark · AU 2896 · TC 2800
Life of the patent
7 dated eventsAbstract
The present invention provides a dicing tape-integrated wafer back surface protective film including: a dicing tape including a base material and a pressure-sensitive adhesive layer formed on the base material; and a wafer back surface protective film formed on the pressure-sensitive adhesive layer of the dicing tape, in which the wafer back surface protective film is colored. It is preferable that the colored wafer back surface protective film has a laser marking ability. The dicing tape-integrated wafer back surface protective film can be suitably used for a flip chip-mounted semiconductor device.
Claims
5 · 1 independent · depth 2Classifications
6 codes- H01L23/52
- H01L29/40
- H01L23/48
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1 priority documents›Priority documents — 1
| Type | Document | Date |
|---|---|---|
| related publication | US 20140091480 A1 | 3 Apr 2014 |
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