FIG. 1 is an enlarged top isometric view of a deposition ring for a semiconductor processing chamber, according to the first embodiment of the novel design.

FIG. 2 is a front elevation view thereof.

FIG. 3 is a back elevation view thereof.

FIG. 4 is a right elevation view thereof.

FIG. 5 is a left elevation view thereof.

FIG. 6 is a top plan view thereof.

FIG. 7 is a bottom plan view thereof.

FIG. 8 is an enlarged cross-sectional view thereof, taken along line 6 - 6 of FIG. 6 .

FIG. 9 is an enlarged top isometric view of a deposition ring for a semiconductor processing chamber, according to the second embodiment of the novel design.

FIG. 10 is a front elevation view thereof.

FIG. 11 is a back elevation view thereof.

FIG. 12 is a right elevation view thereof.

FIG. 13 is a left elevation view thereof.

FIG. 14 is a top plan view thereof.

FIG. 15 is a bottom plan view thereof.

FIG. 16 is an enlarged cross-sectional view thereof, taken along line 16 - 16 of FIG. 14 ; and,

FIG. 17 is an enlarged cross-sectional view thereof, taken along line 17 - 17 of FIG. 14 .

The dashed lines in FIGS. 1-9 represent unclaimed environment forming no part of the claimed design.

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Claims

1 · 1 independent · depth 1

1 granted claims

›1.independentThe ornamental design for a deposition ring for a semiconductor processing chamber, as shown and described.

Classifications

2 codes

USPC · US Patent Classification

D15/138D13/182

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Pendency

1.2 y

445 days filing → grant

Office actions

none on record

Responses

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Examiner

Sheryl Lane

art unit 2915 · TC 2900

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Worldwide family

5 members · 3 offices

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Members

DOCDB simple family 78069701

Offices

US · JP

Granted

3 of 5

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›IP5 & PCT — 3 members

Office	Publication	Kind	Published	Filed	Status	Title
USthis patent	US-D933726-S	S1	19 Oct 2021	31 Jul 2020	granted	Deposition ring for a semiconductor processing chamber
JP	JP-1704604-S	S	13 Jan 2022	1 Feb 2021	granted	半導体処理チャンバのための堆積リングja
JP	JP-1708687-S	S	1 Mar 2022	1 Feb 2021	granted	半導体処理チャンバのための堆積リングja

›Other offices — 2 members

Office	Publication	Kind	Published	Filed	Status	Title
TW	TW-D217572-S	S	11 Mar 2022	25 Jan 2021	published	用於半導體處理腔室的沉積環zh
TW	TW-D217686-S	S	11 Mar 2022	25 Jan 2021	published	Deposition ring for a semiconductor processing chamber

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