USPatentGranted
S1

Wafer transfer apparatus

Granted 19 Feb 2008 · 4 office actions

Assignee: Tokyo Electron Limited

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Attorney: Attorney · Log in to unlock

Inventors: Takehiro Shindo, Wataru Machiyama, Tsutomu Hiroki · Examiner: Cynthia E. Ramirez · AU 2911 · TC 2900

Application
29/220,627
filed 5 Jan 2005
Publication
Not published
not published
Patent· this page
US D562524
granted 19 Feb 2008

Life of the patent

9 dated events
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Description

1 parts
›FIG. 1 is a top view of the…

FIG. 1 is a top view of the wafer transfer apparatus of the present design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a back elevational view thereof;

FIG. 4 is a bottom view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a reference figure showing a perspective view seen from a back-left hand side of the apparatus;

FIG. 8 is a reference figure showing a top view seen from a back-left hand side of the apparatus;

FIG. 9 is a reference figure showing a perspective view seen from a front-right hand side of the apparatus;

FIG. 10 is a reference figure showing a perspective view seen from a back-right hand side of the apparatus;

FIG. 11 is a reference figure showing a right side view seen from a back side of the apparatus;

FIG. 12 is a reference figure showing a perspective view seen from the back-left hand side of the apparatus;

FIG. 13 is a reference figure showing a perspective view seen from a front-right hand side of the apparatus;

FIG. 14 is a reference figure showing a perspective view seen from the front-left hand side of the apparatus;

FIG. 15 is a reference figure showing a perspective view seen from a back-left hand side of the apparatus; and,

FIG. 16 is a reference figure showing a perspective view seen from a back-right hand side of the apparatus.

The broken line showing of wafers in some of the figures is included for the purpose of illustrating environment and forms no part of the claimed design.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims

1 · 1 independent · depth 1
1 granted claims

Classifications

2 codes
USPC · US Patent Classification
D34/28D34/35

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File wrapper

⤢ drag to zoomJan 2005Jul 2005Jan 2006Jul 2006Jan 2007Jul 2007Jan 2008USPTOApplicantNon-final rejectionResponse after non-finalResponse after non-final
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Pendency
3.1 y
1,140 days filing → grant
Office actions
2
non-final + final
Responses
2
no RCE
Examiner
Cynthia E. Ramirez
art unit 2911 · TC 2900
Citations: 17 back · 0 forward

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Chain of title

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Term & fees

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Worldwide family

2 members · 2 offices
US1TW1
this patentIP5 & PCTother officessolid = grantedhover for detail · click to open
Members
2
DOCDB simple family 39060172
Offices
2
US
Granted
1 of 2
grant date present
Non-English titles
1
shown as filed, never translated
›IP5 & PCT — 1 members
OfficePublicationKindPublishedFiledStatusTitle
USthis patentUS-D562524-SS119 Feb 20085 Jan 2005grantedWafer transfer apparatus
›Other offices — 1 members
OfficePublicationKindPublishedFiledStatusTitle
TWTW-D107385-S1S11 Nov 200522 Oct 2004published晶圓搬運機zh

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Citations

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