Wafer transfer apparatus
Granted 19 Feb 2008 · 2 office actions
Assignee: Tokyo Electron Limited
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Attorney: Attorney · Log in to unlock
Inventors: Takehiro Shindo, Wataru Machiyama, Tsutomu Hiroki · Examiner: Cynthia E. Ramirez · AU 2911 · TC 2900
Life of the application
9 dated eventsDescription
1 parts›FIG. 1 is a top view of the…
FIG. 1 is a top view of the wafer transfer apparatus of the present design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a back elevational view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a reference figure showing a perspective view seen from a back-left hand side of the apparatus;
FIG. 8 is a reference figure showing a top view seen from a back-left hand side of the apparatus;
FIG. 9 is a reference figure showing a perspective view seen from a front-right hand side of the apparatus;
FIG. 10 is a reference figure showing a perspective view seen from a back-right hand side of the apparatus;
FIG. 11 is a reference figure showing a right side view seen from a back side of the apparatus;
FIG. 12 is a reference figure showing a perspective view seen from the back-left hand side of the apparatus;
FIG. 13 is a reference figure showing a perspective view seen from a front-right hand side of the apparatus;
FIG. 14 is a reference figure showing a perspective view seen from the front-left hand side of the apparatus;
FIG. 15 is a reference figure showing a perspective view seen from a back-left hand side of the apparatus; and,
FIG. 16 is a reference figure showing a perspective view seen from a back-right hand side of the apparatus.
The broken line showing of wafers in some of the figures is included for the purpose of illustrating environment and forms no part of the claimed design.
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