Group-III nitride semiconductor laser device, and method for fabricating group-III nitride semiconductor laser device

A III-nitride semiconductor laser device comprising:na laser structure including a support base and a semiconductor region, the support base comprising a hexagonal III-nitride semiconductor and having a semipolar primary surface, and the semiconductor region being provided on the semipolar primary surface of the support base; andan electrode provided on the semiconductor region of the laser structure, the semiconductor region including a first cladding layer comprised of a first conductivity type GaN-based semiconductor, a second cladding layer comprised of a second conductivity type GaN-based semiconductor, and an active layer provided between the first cladding layer and the second cladding layer, the first cladding layer, the second cladding layer, and the active layer being arranged along an axis normal to the semipolar primary surface, a c-axis of the hexagonal III-nitride semiconductor of the support base being inclined at an angle ALPHA with respect to the normal axis toward an m-axis of the hexagonal III-nitride semiconductor, the laser structure including first and second fractured faces, the first and second fractured faces intersecting with an m-n plane, the m-n plane being defined by the normal axis and the m-axis of the hexagonal III-nitride semiconductor, a laser cavity of the III-nitride semiconductor laser device including the first and second fractured faces, the laser structure including first and second surfaces, the first surface being opposite to the second surface, each of the first and second fractured faces extending from an edge of the first surface to an edge of the second surface, and each of the first and second fractured faces having a stripe structure on an end face of the support base, the stripe structure extending in a direction from one to the other of the first and second surfaces;wherein the angle ALPHA between the normal axis and the c-axis of the hexagonal III-nitride semiconductor is in one of a range of not less than 45 degrees and not more than 80 degrees and a range of not less than 100 degrees and not more than 135 degrees; andwherein an end face of the support base and an end face of the semiconductor region are exposed in each of the first and second fractured faces, and an angle between the end face of the active layer of the semiconductor region and a reference plane perpendicular to the m-axis of the support base of the hexagonal nitride semiconductor is in a range of not less than (ALPHA−5) degrees and not more than (ALPHA+5) degrees on a first plane defined by the c-axis and the m-axis of the III-nitride semiconductor.