A method for producing a group III nitride semiconductor light-emitting device, in which a buffer layer made of a group III nitride is laminated on a substrate, and an n-type semiconductor layer comprising a base layer, a light-emitting layer, and a p-type semiconductor layer are laminated on the buffer layer in this order, comprising:na pretreatment step in which the substrate is treated with plasma;a buffer layer formation step in which the buffer layer having a composition represented by AlxGa1-xN (0≦x<0.5) is formed as a single crystal on the pretreated substrate by activating with plasma and reacting at least a metal gallium raw material and a gas containing a group V element; anda base layer formation step in which the base layer is formed on the buffer layer.
›2.↳ 1A method for producing a group III nitride semiconductor light-emitting device according to claim 1, wherein the base layer is formed by a metalorgani…d2
A method for producing a group III nitride semiconductor light-emitting device according to claim 1, wherein the base layer is formed by a metalorganic chemical vapor deposition method in the base layer formation step.
›3.↳ 1A method for producing a group III nitride semiconductor light-emitting device according to claim 1, wherein the pretreatment step is carried out by f…d2+1
A method for producing a group III nitride semiconductor light-emitting device according to claim 1, wherein the pretreatment step is carried out by flowing a gas containing nitrogen into a chamber in a layer formation device.
›4.↳ 3A method for producing a group III nitride semiconductor light-emitting device according to claim 3, wherein the partial pressure of the gas containin…d3
A method for producing a group III nitride semiconductor light-emitting device according to claim 3, wherein the partial pressure of the gas containing nitrogen which is flowed into the chamber is in a range of from 1×10−2 Pa to 10 Pa.
›5.↳ 1A method for producing a group III nitride semiconductor light-emitting device according to claim 1, wherein the pretreatment step is carried out in a…d2
A method for producing a group III nitride semiconductor light-emitting device according to claim 1, wherein the pretreatment step is carried out in a chamber, and the pressure in the chamber is in a range of from 0.1 Pa to 5 Pa.
›6.↳ 1A method for producing a group III nitride semiconductor light-emitting device according to claim 1, wherein the time for the pretreatment step is in …d2+1
A method for producing a group III nitride semiconductor light-emitting device according to claim 1, wherein the time for the pretreatment step is in a range of from 30 seconds to 3,600 seconds.
›7.↳ 6A method for producing a group III nitride semiconductor light-emitting device according to claim 6, wherein the time for the pretreatment is in a ran…d3
A method for producing a group III nitride semiconductor light-emitting device according to claim 6, wherein the time for the pretreatment is in a range of from 60 seconds to 600 seconds.
›8.↳ 1A method for producing a group III nitride semiconductor light-emitting device according to claim 1, wherein the temperature of the substrate in the p…d2+1
A method for producing a group III nitride semiconductor light-emitting device according to claim 1, wherein the temperature of the substrate in the pretreatment step is in a range of from 25° C. to 1,000° C.
›9.↳ 8A method for producing a group III nitride semiconductor light-emitting device according to claim 8, wherein the temperature of the substrate in the p…d3
A method for producing a group III nitride semiconductor light-emitting device according to claim 8, wherein the temperature of the substrate in the pretreatment step is in a range of from 300° C. to 800° C.
›10.↳ 1A method for producing a group III nitride semiconductor light-emitting device according to claim 1, wherein the pretreatment step and the buffer laye…d2
A method for producing a group III nitride semiconductor light-emitting device according to claim 1, wherein the pretreatment step and the buffer layer formation step are carried out in the same chamber.
›11.↳ 1A method for producing a group III nitride semiconductor light-emitting device according to claim 1, wherein the plasma treatment in the pretreatment …d2+2
A method for producing a group III nitride semiconductor light-emitting device according to claim 1, wherein the plasma treatment in the pretreatment step is sputter cleaning.
›12.↳ 11A method for producing a group III nitride semiconductor light-emitting device according to claim 11, wherein the sputter cleaning is carried out by g…d3+1
A method for producing a group III nitride semiconductor light-emitting device according to claim 11, wherein the sputter cleaning is carried out by generating plasma using an electrical power supply having high frequency in the pretreatment step.
›13.↳ 12A method for producing a group III nitride semiconductor light-emitting device according to claim 12, wherein the sputter cleaning is carried out by g…d4
A method for producing a group III nitride semiconductor light-emitting device according to claim 12, wherein the sputter cleaning is carried out by generating nitrogen plasma using an electrical power supply having high frequency in the pretreatment step.
›14.↳ 1A method for producing a group III nitride semiconductor light-emitting device according to claim 1, wherein the method further comprises a substrate …d2
A method for producing a group III nitride semiconductor light-emitting device according to claim 1, wherein the method further comprises a substrate processing step in which irregularity is formed on the surface of the substrate before the pretreatment step.
›15.↳ 1A method for producing a group III nitride semiconductor light-emitting device according to claim 1, wherein the buffer layer is formed so as to cover…d2
A method for producing a group III nitride semiconductor light-emitting device according to claim 1, wherein the buffer layer is formed so as to cover at least 90% of a main surface of the substrate in the buffer layer formation step.
›16.↳ 1A method for producing a group III nitride semiconductor light-emitting device according to claim 1, wherein the buffer layer is formed by a reactive …d2+5
A method for producing a group III nitride semiconductor light-emitting device according to claim 1, wherein the buffer layer is formed by a reactive sputtering method in the buffer layer formation step.
›17.↳ 16A method for producing a group III nitride semiconductor light-emitting device according to claim 16, wherein the buffer layer is formed by a reactive…d3
A method for producing a group III nitride semiconductor light-emitting device according to claim 16, wherein the buffer layer is formed by a reactive sputtering method which flows a gas containing the group V element into a reactor in the buffer layer formation step.
›18.↳ 16A method for producing a group III nitride semiconductor light-emitting device according to claim 16, wherein the buffer layer is formed by an RF sput…d3+1
A method for producing a group III nitride semiconductor light-emitting device according to claim 16, wherein the buffer layer is formed by an RF sputtering method in the buffer layer formation step.
›19.↳ 18A method for producing a group III nitride semiconductor light-emitting device according to claim 18, wherein the buffer layer is formed by an RF sput…d4
A method for producing a group III nitride semiconductor light-emitting device according to claim 18, wherein the buffer layer is formed by an RF sputtering method while moving a cathode magnet in the buffer layer formation step.
›20.↳ 16A method for producing a group III nitride semiconductor light-emitting device according to claim 16, wherein the buffer layer is formed by a DC sputt…d3+1
A method for producing a group III nitride semiconductor light-emitting device according to claim 16, wherein the buffer layer is formed by a DC sputtering method in the buffer layer formation step.
›21.↳ 20A method for producing a group III nitride semiconductor light-emitting device according to claim 20, wherein the buffer layer is formed by a pulsed D…d4
A method for producing a group III nitride semiconductor light-emitting device according to claim 20, wherein the buffer layer is formed by a pulsed DC sputtering method in the buffer layer formation step.
›22.↳ 1A method for producing a group III nitride semiconductor light-emitting device according to claim 1, wherein the group V element used in the buffer la…d2
A method for producing a group III nitride semiconductor light-emitting device according to claim 1, wherein the group V element used in the buffer layer formation step is nitrogen.
›23.↳ 1A method for producing a group III nitride semiconductor light-emitting device according to claim 1, wherein the gas containing the group V element us…d2
A method for producing a group III nitride semiconductor light-emitting device according to claim 1, wherein the gas containing the group V element used in the buffer layer formation step is ammonia.
›24.↳ 1A method for producing a group III nitride semiconductor light-emitting device according to claim 1, wherein the temperature of the substrate in the b…d2+1
A method for producing a group III nitride semiconductor light-emitting device according to claim 1, wherein the temperature of the substrate in the buffer layer formation step is in a range of room temperature to 1,000° C.
›25.↳ 24A method for producing a group III nitride semiconductor light-emitting device according to claim 24, wherein the temperature of the substrate in the …d3
A method for producing a group III nitride semiconductor light-emitting device according to claim 24, wherein the temperature of the substrate in the buffer layer formation step is in a range of 200° C. to 800° C.
›26.↳ 1A method for producing a group III nitride semiconductor light-emitting device according to claim 1, wherein the temperature of the substrate in the b…d2
A method for producing a group III nitride semiconductor light-emitting device according to claim 1, wherein the temperature of the substrate in the base layer formation step is 900° C. or more.
›27.↳ 1A group III nitride semiconductor light-emitting device obtained by the method according to claim 1.d2
A group III nitride semiconductor light-emitting device obtained by the method according to claim 1.