Sensing module
Granted 24 Mar 2026
Current assignee: Taiwan-Asia Semiconductor Corporation · originally Taiwan Semiconductor Manufacturing Company
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Inventors: Chun-Chieh Lin · Examiner: Antoine Duval Davis · AU 2917 · TC 2900
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3 dated eventsDescription
1 parts›FIG. 1 is a perspective view of a…
FIG. 1 is a perspective view of a sensing module showing the claimed design;
FIG. 2 is front elevational view thereof; a rear elevational view being symmetric to the front elevational view;
FIG. 3 is a left side elevational view thereof; a right side elevational view being symmetric to the left side elevational view;
FIG. 4 is a top plan view thereof; and,
FIG. 5 is a bottom plan view thereof.
The broken lines are directed to environment and are for illustrative purpose only; the broken lines form no part of the claimed design.
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