Sensing module
Granted 24 Mar 2026 · no office action yet
Current assignee: Taiwan-Asia Semiconductor Corporation · originally Taiwan Semiconductor Manufacturing Company
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Inventors: Chun-Chieh Lin · Examiner: Antoine Duval Davis · AU 2917 · TC 2900
Life of the patent
2 dated eventsDescription
1 parts›FIG. 1 is a perspective view of a…
FIG. 1 is a perspective view of a sensing module showing the claimed design;
FIG. 2 is front elevational view thereof; a rear elevational view being symmetric to the front elevational view;
FIG. 3 is a left side elevational view thereof; a right side elevational view being symmetric to the left side elevational view;
FIG. 4 is a top plan view thereof; and,
FIG. 5 is a bottom plan view thereof.
The broken lines are directed to environment and are for illustrative purpose only; the broken lines form no part of the claimed design.
Claims
1 · 1 independent · depth 1Classifications
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3 members · 3 offices›IP5 & PCT — 2 members
| Office | Publication | Kind | Published | Filed | Status | Title |
|---|---|---|---|---|---|---|
| USthis patent | US-D1119797-S | S1 | 24 Mar 2026 | 20 May 2024 | granted | Sensing module |
| JP | JP-1781270-S | S | 2 Oct 2024 | 11 Jun 2024 | granted | センサモジュールja |
›Other offices — 1 members
| Office | Publication | Kind | Published | Filed | Status | Title |
|---|---|---|---|---|---|---|
| TW | TW-D234896-S | S | 21 Nov 2024 | 30 Dec 2023 | published | Sensing module |
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