USPatentGranted
S1

Sensing module

Granted 24 Mar 2026 · no office action yet

Current assignee: Taiwan-Asia Semiconductor Corporation · originally Taiwan Semiconductor Manufacturing Company

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Inventors: Chun-Chieh Lin · Examiner: Antoine Duval Davis · AU 2917 · TC 2900

Application
29/943,151
filed 20 May 2024
Publication
Not published
not published
Patent· this page
US D1119797
granted 24 Mar 2026

Life of the patent

2 dated events
⤢ drag to zoomApr 2024Jul 2024Oct 2024Jan 2025Apr 2025Jul 2025Oct 2025Jan 2026Apr 2026Prosecution
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Description

1 parts
›FIG. 1 is a perspective view of a…

FIG. 1 is a perspective view of a sensing module showing the claimed design;

FIG. 2 is front elevational view thereof; a rear elevational view being symmetric to the front elevational view;

FIG. 3 is a left side elevational view thereof; a right side elevational view being symmetric to the left side elevational view;

FIG. 4 is a top plan view thereof; and,

FIG. 5 is a bottom plan view thereof.

The broken lines are directed to environment and are for illustrative purpose only; the broken lines form no part of the claimed design.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims

1 · 1 independent · depth 1
1 granted claims

Classifications

1 codes
USPC · US Patent Classification
D13/118

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File wrapper

Pendency
1.8 y
673 days filing → grant
Office actions
0
on the grant's record
Examiner
Antoine Duval Davis
art unit 2917 · TC 2900
Citations: 6 back · 0 forward

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Worldwide family

3 members · 3 offices
US1JP1TW1
this patentIP5 & PCTother officessolid = grantedhover for detail · click to open
Members
3
DOCDB simple family 92902314
Offices
3
US · JP
Granted
2 of 3
grant date present
Non-English titles
1
shown as filed, never translated
›IP5 & PCT — 2 members
OfficePublicationKindPublishedFiledStatusTitle
USthis patentUS-D1119797-SS124 Mar 202620 May 2024grantedSensing module
JPJP-1781270-SS2 Oct 202411 Jun 2024grantedセンサモジュールja
›Other offices — 1 members
OfficePublicationKindPublishedFiledStatusTitle
TWTW-D234896-SS21 Nov 202430 Dec 2023publishedSensing module

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Citations

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