Inventor
CHUN-CHIEH LIN
Inventor
TW
Overview
Patents· 34 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices22%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1016%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%
B24BMachines, devices, or processes for grinding or polishing5%
A61KPreparations for medical, dental or toiletry purposes4%
A61PSpecific therapeutic activity of chemical compounds or medicinal preparations4%
B08BCleaning in general3%
C09GPolishing compositions3%
LOC133%
A61FFilters implantable into blood vessels2%
PatentTitleYear
D1121612Wearable device body2026D1119797Sensing module202612,581,925Selective metal cap in an interconnect structure202612,557,629Interconnect structure and methods of forming the same2026D1107695Wearable device body2025D1099857Photodiode2025D1096677Photodiode202512,315,809Via for semiconductor device and method202512,220,726Silicide capacitive micro electromechanical structure and fabrication method thereof202512,178,817Compounds for enhancing PPARg expression and nuclear translocation and therapeutic use thereof202412,172,263Chemical mechanical planarization tool202412,170,195Post-CMP cleaning and apparatus202412,168,009Modulators of cystic fibrosis transmembrane conductance regulator202412,154,515Displays with reduced temperature luminance sensitivity202412,094,770Ruthenium-based liner for a copper interconnect202412,080,594Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same202412,002,684Methods for chemical mechanical polishing and forming interconnect structure202411,908,697Interconnect structure having a carbon-containing barrier layer202411,810,857Via for semiconductor device and method202311,772,228Chemical mechanical polishing apparatus including a multi-zone platen202311,728,157Post-CMP cleaning and apparatus202311,679,469Chemical mechanical planarization tool202311,676,898Diffusion barrier for semiconductor device and method202311,660,345Method and composition for enhancing the delivery of anti-platelet drugs for the treatment of acute stroke202311,658,065Chemical mechanical polishing slurry composition, method for chemical mechanical polishing and method for forming connecting structure202311,532,282Displays with reduced temperature luminance sensitivity202211,527,411Interconnect structure having a carbon-containing barrier layer202211,527,476Interconnect structure of semiconductor device202211,508,585Methods for chemical mechanical polishing and forming interconnect structure202211,430,692Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same202211,426,407Modulators of cystic fibrosis transmembrane conductance regulator202211,380,762Semiconductor device having semiconductor alloy layer adjacent a gate structure202211,349,414Apparatus and method for monitoring the relative relationship between the wafer and the chuck202211,322,345Post-CMP cleaning and apparatus2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (21)· patent assignee history
2022–2024Patents assigned to APPLE INC (2)· patent assignee history
2022–2024Patents assigned to VERTEX PHARMA (2)· patent assignee history
2022–2026Based in TW· patent location history
2022–2024Based in US· patent location history
2023–2024Patents assigned to REALINN LIFE SCIENCE LTD (2)· patent assignee history
2025–2026Patents assigned to TAIWAN ASIA SEMICONDUCTOR CORP (6)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 21 | 2022–2026 |
| TAIWAN ASIA SEMICONDUCTOR CORP | 6 | 2025–2026 |
| APPLE INC | 2 | 2022–2024 |
| REALINN LIFE SCIENCE LTD | 2 | 2023–2024 |
| VERTEX PHARMA | 2 | 2022–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 32 | 2022–2026 |
| US | 2 | 2022–2024 |