Flip-chip bonding structure and substrate thereof

This invention relates to a flip-chip bonding structure and its substrate, and more particularly to a flip-chip bonding structure and its substrate which can prevent a bump from sliding or shifting caused by solder overflow.

A conventional flip-chip bonding structure 10 shown in FIGS. 1 and 2 includes a substrate 11 and a chip 12 , bumps 12 a of the chip 12 are bonded to a lead 11 a of the substrate 11 by a solder 12 b . The chip 12 and the bumps 12 a are not shown in the partial enlarged drawing of FIG. 1 in order to explain the situation of the solder 12 b bonded to the lead 11 a of the substrate 11 . If the lead 11 a is a ground lead or it requires an increased bonding surface 11 b for electrical requirement, the bonding surface 11 b of the lead 11 a is designed to be larger than a bonding surface 12 c of the solder 12 b . However, the solder 12 b may overflow on the bonding surface 11 b of the lead 11 during bonding to cause slide or shift of the bumps 12 a and further cause the moved chip 12 to be bonded to the substrate 11 incorrectly, and the solder 12 b overflowing on the bonding surface 11 b also may contaminate the lead 11 a or bridge the adjacent leads. Moreover, the overall height of the substrate 11 and the chip 12 after bonding cannot be controlled well owing to the solder 12 b overflowing on the bonding surface 11 b.

One object of the present invention is to provide a flip-chip bonding structure and its substrate. A hollow opening, a bonding island and at least one connecting bridge are provided on a body of a lead, the body and the bonding island are separated by a hollow space of the hollow opening, and a solder on a bump is restricted on the bonding island when the bump is bonded to the bonding island. Thus, it is possible to avoid the problems of bump sliding, solder contamination, bridge of the adjacent leads or insufficient bonding height.

A flip-chip bonding structure of the present invention includes a chip and a substrate which includes a carrier and at least one lead. The lead is located on the carrier and includes a body, a hollow opening, a bonding island and a first connecting bridge. The hollow opening is in the body and surrounded by the body, the bonding island is located in the hollow opening such that there is a hollow space in the hollow opening and located between the body and the bonding island. The first connecting bridge is located in the hollow space and its both ends are connected to the bonding island and the body respectively to allow the bonding island to be electrically connected to the body. The chip includes at least one bump and a solder and is bonded to a bonding surface of the bonding island by the solder located on the bump. A gap exists between a side surface of the solder and an inner side surface of the hollow opening.

A substrate of a flip-chip bonding structure of the present invention includes a carrier and at least one lead which is located on the carrier and includes a body, a hollow opening, a bonding island and a first connecting bridge. The hollow opening is in the body and surrounded by the body, the bonding island provided to bond to at least one bump of a chip is located in the hollow opening such that there is a hollow space in the hollow opening and located between the body and the bonding island. The first connecting bridge is located in the hollow space and its both ends are connected to the bonding island and the body respectively to allow the bonding island to be electrically connected to the body.

In the present invention, the solder on the bonding island is separated from the body by the hollow space located between the body and the bonding island such that the solder is restricted on the bonding island to avoid overflow of the solder.

FIG. 1 is a top view diagram illustrating a conventional flip-chip binding structure.

FIG. 2 is a cross-section view diagram along A-A line of FIG. 1 .

FIG. 3 is a top view diagram illustrating a part of a substrate of a flip-chip bonding structure in accordance with a first embodiment of the present invention.

FIG. 4 is a top view diagram illustrating a part of a flip-chip bonding structure in accordance with a first embodiment of the present invention.

FIG. 5 is a cross-section view diagram along B-B line of FIG. 4 .

FIG. 6 is a cross-section view diagram along C-C line of FIG. 4 .

FIG. 7 is a cross-section view diagram along D-D line of FIG. 4 .

FIG. 8 is a top view diagram illustrating a part of a substrate of a flip-chip bonding structure in accordance with a second embodiment of the present invention.

FIG. 9 is a top view diagram illustrating a part of a substrate of a flip-chip bonding structure in accordance with a third embodiment of the present invention.

A flip-chip bonding structure 100 in accordance with a first embodiment of the present invention is represented in FIGS. 3 to 7 . The flip-chip bonding structure 100 includes a substrate 110 and a chip 120 , the substrate 110 includes a carrier 111 and at least one lead 112 located on the carrier 111 , the chip 120 includes at least one bump 121 and a solder 122 and is bonded to the lead 112 by the solder 122 located on the bump 121 .

With reference to FIG. 3 , the lead 112 , may be a ground lead or a signal lead with increased bonding surface for electrical requirement, includes a body 113 , a hollow opening 114 , a bonding island 115 and a first connecting bridge 116 . The hollow opening 114 is located in the body 113 and surrounded by the body 113 , and in this embodiment, the carrier 111 is visible from the hollow opening 114 . The bonding island 115 , whose shape may be circular, oval, triangle, square or polygon, is arranged in the hollow opening 114 such that there is a hollow space 114 a in the hollow opening 114 and located between the body 113 and the bonding island 115 . The first connecting bridge 116 is located in the hollow space 114 a and its both ends, a first end 116 a and a second end 116 b , are connected to the bonding island 115 and the body 113 , respectively, to allow the bonding island 115 to be electrically connected to the body 113 .

With reference to FIG. 3 , the lead 112 of the first embodiment further includes a second connecting bridge 117 which is also located in the hollow space 114 a . There is an included angle 118 between the first connecting bridge 116 and the second connecting bridge 117 , and the included angle 118 can be less than, equal to or greater than 90 degrees. Both ends, a third end 117 a and a fourth end 117 b , of the second connecting bridge 117 are connected to the bonding island 115 and the body 113 , respectively. Because of the first connecting bridge 116 and the second connecting bridge 117 , the hollow space 114 a is divided into a first hollow portion 114 b and a second hollow portion 114 c . The first connecting bridge 116 and the second connecting bridge 117 are located between the first hollow portion 114 a and the second hollow portion 114 c , respectively.

With reference to FIG. 3 , a first axis X 1 passes through the bonding island 115 and the first connecting bridge 116 , and a second axis X 2 passes through the bonding island 115 and the second connecting bridge 117 . In a direction parallel to the first axis X 1 , the width of the bonding island 115 is referred to as a first width W 1 , the width of the hollow space 114 a located between the body 113 and the bonding island 115 is referred to as a second width W 2 , the second width W 2 is not greater than the first width W 1 , and preferably, the second width W 2 is less than the first width W 1 . In a direction perpendicular to the first axis X 1 , the width of the bonding island 115 is referred to as a third width W 3 , the width of the first connecting bridge 116 is referred to as a fourth width W 4 , and the fourth width W 4 is less than the third width W 3 . In a direction perpendicular to the second axis X 2 , the width of the bonding island 115 is referred to as a fifth width W 5 , the width of the second connecting bridge 117 is referred to as a sixth width W 6 , and the sixth width W 6 is less than the fifth width W 5 .

In order to show the bump 121 which is bonded to the bonding island 115 by the solder 122 , the chip 120 is omitted in the FIG. 4 . Referring to FIGS. 4 , 5 and 7 , the bump 121 of the chip 120 is bonded to a bonding surface 115 a of the bonding island 115 by the solder 122 located on the bump 121 , and a gap exists between a side surface 122 a of the solder 122 and an inner side surface 114 d of the hollow opening 114 . Because of the hollow space 114 a , the solder 122 is separated from the body 113 to prevent the solder 122 from overflowing to the body 113 . In this embodiment, the width of the bump 121 in the direction parallel to the first axis X 1 , parallel to the second axis X 2 , perpendicular to the first axis X 1 or perpendicular to the second axis X 2 is referred to as a width W 7 , and preferably, the first width W 1 , the third width W 3 and/or the fifth width W 5 of the bonding island 115 is less than the width W 7 of the bump 121 . Accordingly, a side portion 122 b of the solder 122 can cover a side surface 115 b of the bonding island 115 , and the solder 122 can be stably adhered to the bonding island 115 to prevent the bump 121 from sliding or shifting. With reference to FIGS. 4 and 6 , the solder 122 preferably further covers a top surface 116 c and a side surface 116 d of the first end 116 a of the first connecting bridge 116 to increase the bonding area between the solder 122 and the bonding island 115 . In this embodiment, the side portion 122 b of the solder pater 122 is accommodated in the hollow space 114 a . Because the hollow space 114 a is provided between the body 113 and the bonding island 115 , the side portion 122 b of the solder 122 is separated from the body 113 to prevent the solder 122 from overflowing to the body 113 .

A second embodiment of the present invention is shown in FIG. 8 . Different to the first embodiment, the lead 112 of the second embodiment includes a plurality of second connecting bridges 117 , the third end 117 a and the fourth end 117 b of each of the second connecting bridges 117 are connected to the bonding island 115 and the body 113 , respectively. There is an included angle 118 between the first connecting bridge 116 and each of the second connecting bridges 117 . With reference to FIG. 9 which shows a third embodiment of the present invention, the difference between the first and third embodiments is that the lead 112 includes a plurality of bonding islands 115 , a plurality of first connecting bridges 116 and a plurality of second connecting bridges 117 in the third embodiment. The bonding islands 115 are located in the hollow opening 114 , a gap exists between the adjacent bonding islands 115 . The first end 116 a and the second end 116 b of each of the first connecting bridges 116 are connected to the corresponding bonding island 115 and the body 113 , respectively. And the third end 117 a and the fourth end 117 b of each of the second connecting bridges 117 are connected to the corresponding bonding island 115 and the body 113 , respectively.

While this invention has been particularly illustrated and described in detail with respect to the preferred embodiments thereof, it will be clearly understood by those skilled in the art that is not limited to the specific features shown and described and various modified and changed in form and details may be made without departing from the scope of the claims.