LexDanaLexDanabeta
Inventor

PAI-SHENG CHENG

Inventor
TW

Overview

2→
Patents
2025–2026
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
H01LSemiconductor devices20%
H05KPrinted circuits20%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
PatentTitleYear
12,543,581Flip-chip bonding structure and substrate thereof202612,317,462Electronic package and method of manufacturing the same2025

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2025–2026Patents assigned to CHIPBOND TECHNOLOGY CORP (2)· patent assignee history
2025–2026Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
CHIPBOND TECHNOLOGY CORP22025–2026
Locations
LocationPatentsSpan
TW22025–2026