Inventor
CHEN-YU WANG
Inventor
TW
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices21%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
C25DProcesses for the electrolytic or electrophoretic production of coatings8%
C08CTreatment or chemical modification of rubbers4%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds4%
C08LCompositions of macromolecular compounds4%
C23CCoating metallic material4%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems4%
H03KPulse technique4%
PatentTitleYear
12,543,581Flip-chip bonding structure and substrate thereof202612,538,805Semiconductor package and method of manufacturing the same202612,525,481Clamp assembly202612,394,768Package structure202512,317,462Electronic package and method of manufacturing the same202512,224,183Method of manufacturing semiconductor device2025D1059315Package structure for a semiconductor element202512,146,049Styrene-isoprene/butadiene diblock copolymer, hydrogenated block copolymer, composition formed therefrom, and the use thereof202411,476,772Voltage converter circuit for converting AC voltage to DC voltage2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022Patents assigned to EPISTAR CORP (1)· patent assignee history
2022–2026Based in TW· patent location history
2024Patents assigned to LCY CHEMICAL CORP (1)· patent assignee history
2025–2026Patents assigned to CHIPBOND TECHNOLOGY CORP (5)· patent assignee history
2025Patents assigned to GANRICH SEMICONDUCTOR CORP (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| CHIPBOND TECHNOLOGY CORP | 5 | 2025–2026 |
| GANRICH SEMICONDUCTOR CORP | 2 | 2025 |
| EPISTAR CORP | 1 | 2022 |
| LCY CHEMICAL CORP | 1 | 2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 9 | 2022–2026 |