USPatent applicationPatented

Pattern measuring apparatus

Granted 31 Dec 2013 · no office action yet

Current assignee: Hitachi High-Technologies Corporation · originally Hitachi, Ltd.

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Inventors: Hiroshi Nishihama, Tatsuya Maeda, Susumu Koyama, Mitsuji Ikeda · Examiner: Nikita Wells · AU 2881 · TC 2800

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Abstract

An object of the present invention is to provide a pattern measuring apparatus which performs high-accuracy concavity/convexity determination (e.g., distinguishing between a line segment and space) while simultaneously reducing the dose of a beam falling onto a pattern to be measured. To attain the object, this invention proposes a pattern measuring apparatus which specifies a pattern in a measurement object area by scanning a tilted bean with respect to another area different from the measurement object area and then performs measurement based on the pattern-specifying result. With such arrangement, it becomes possible to perform measurement without the risk of wrong pattern designation while lowering the dose of a beam hitting the measurement object area.

Claims as granted

10 claims

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Classifications

9 codes
IPC · International Patent Classification
Section G — Physics
  • G01N23/00
Section H — Electricity
  • H01J37/28
  • H01J37/256
USPC · US Patent Classification
250/492.22250/310250/306250/311250/492.3250/396.R

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Pendency
0.8 y
299 days filing → grant
Office actions
0
none on record
Responses
0
1 RCE
Examiner
Nikita Wells
art unit 2881 · TC 2800
Citations: 8 back · 0 forward

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Chain of title

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