Pattern measuring apparatus
Granted 31 Dec 2013 · no office action yet
Current assignee: Hitachi High-Technologies Corporation · originally Hitachi, Ltd.
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Inventors: Hiroshi Nishihama, Tatsuya Maeda, Susumu Koyama, Mitsuji Ikeda · Examiner: Nikita Wells · AU 2881 · TC 2800
Life of the patent
6 dated eventsAbstract
An object of the present invention is to provide a pattern measuring apparatus which performs high-accuracy concavity/convexity determination (e.g., distinguishing between a line segment and space) while simultaneously reducing the dose of a beam falling onto a pattern to be measured. To attain the object, this invention proposes a pattern measuring apparatus which specifies a pattern in a measurement object area by scanning a tilted bean with respect to another area different from the measurement object area and then performs measurement based on the pattern-specifying result. With such arrangement, it becomes possible to perform measurement without the risk of wrong pattern designation while lowering the dose of a beam hitting the measurement object area.
Claims
10 · 2 independent · depth 3Classifications
9 codes- G01N23/00
- H01J37/28
- H01J37/256
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