A mold compound is provided for encapsulating a semiconductor device ( 101 ). The mold compound comprises at least approximately 70% by weight silica fillers, at least approximately 10% by weight epoxy resin system, and beneficial ions that are beneficial with respect to copper ball bond corrosion. A total level of the beneficial ions in the mold compound is at least approximately 100 ppm.

Claims as granted

19 claims

Classifications

4 codes

IPC · International Patent Classification

Section H — Electricity

H01L23/532

USPC · US Patent Classification

257/787257/E21.02257/788

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Pendency

1.3 y

477 days filing → grant

Office actions

non-final + final

Responses

no RCE

Examiner

Roy Potter

art unit 2822 · TC 2800

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Citations: 12 back · 0 forward

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