A mold compound is provided for encapsulating a semiconductor device ( 101 ). The mold compound comprises at least approximately 70% by weight silica fillers, at least approximately 10% by weight epoxy resin system, and beneficial ions that are beneficial with respect to copper ball bond corrosion. A total level of the beneficial ions in the mold compound is at least approximately 100 ppm.

Claims

19 · 3 independent · depth 2

19 granted claims

›1.independentA mold compound for encapsulating an electronic device, the mold compound comprising:nsilica fillers;epoxy resin system; andbeneficial ions that are b…+6

›2.↳ 1The mold compound of claim 1, wherein the beneficial ions are a combination of formate (HCOO)âˆ’ and acetate (CH3CO2)âˆ’ ions.d2

›3.↳ 1The mold compound of claim 1,nwherein the mold compound comprises at least approximately 70% by weight silica fillers and at least approximately 10% b…d2

›4.↳ 1The mold compound of claim 1,nwherein a pH level of the mold compound is greater than or equal to 6.5, anda level of chloride ions in the mold compoun…d2

›5.↳ 1The mold compound of claim 1,nwherein a pH level of the mold compound is 6.0-8.0,a level of chloride ions in the mold compound is less than or equal t…d2

›6.↳ 1The mold compound of claim 1,nwherein a pH level of the mold compound is greater than or equal to 5.0,a level of chloride ions in the mold compound is…d2

›7.↳ 1The mold compound of claim 1, wherein at least one of:na moisture absorption level of the mold compound is less than 0.3% by weight,an oxalate ion lev…d2

›8.independentA mold compound for encapsulating an electronic device, a pH level of the mold compound being greater than or equal to 6.5, and a level of chloride io…+6

›9.↳ 8The mold compound of claim 8,nwherein the mold compound comprises at least approximately 70% by weight silica fillers, and at least approximately 10% …d2

›10.↳ 8The mold compound of claim 8,nwherein a pH level of the mold compound is greater than or equal to 6.0,a level of chloride ions in the mold compound is…d2

›11.↳ 8The mold compound of claim 8,nwherein a pH level of the mold compound is greater than or equal to 7.0,a level of chloride ions in the mold compound is…d2

›12.↳ 8The mold compound of claim 8,nwherein a pH level of the mold compound is greater than or equal to 5.0,a level of chloride ions in the mold compound is…d2

›13.↳ 8The mold compound of claim 8, wherein an operating voltage level of the electronic device is less than or equal to 6V.d2

›14.↳ 8The mold compound of claim 8, wherein at least one of:na moisture absorption level of the mold compound is less than 0.3% by weight,an oxalate ion lev…d2

›15.independentA semiconductor device package comprising:nan electronic device that includes an aluminum bond pad;a copper wire bonded to the aluminum bond pad; anda…+4

Classifications

4 codes

IPC · International Patent Classification

Section H — Electricity

H01L23/532

USPC · US Patent Classification

257/787257/E21.02257/788

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Pendency

1.3 y

477 days filing → grant

Office actions

non-final + final

Responses

no RCE

Examiner

Roy Potter

art unit 2822 · TC 2800

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Citations: 12 back · 0 forward

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