Multi-transistor memory cells

This application is a continuation of International Application No. PCT/EP2004/052184, filed Sep. 15, 2004, which claims priority to German application 103 44 604.4, filed Sep. 25, 2003, both of which are incorporated in their entirety by reference herein.

1. Field of the Invention

The invention relates to a memory cell having multiple transistors and at least one storage capacitor, and in particular to a memory cell having three field-effect transistors (FET's).

2. Description of the Related Art

Memory units may include a charge storage unit, such as a capacitive component. Data may be represented as a charge or absence of charge in the charge storage unit. A leakage current may drain a charge stored in the charge storage unit. To compensate for leakage, the charge may be repeatedly and/or periodically refreshed. A refresh may include providing a current to the charge storage unit to build up the charge in the charge storage device. Memory units for which a clock signal for the refresh depends on a clock signal of a processor externally arranged from the memory unit may be referred to as dynamic random access memories (DRAM's). Where a clock signal for the refresh is generated by logic arranged on the same chip or with the memory may be referred to as an embedded DRAM or a pseudo-static read only memory (SRAM).

The memory unit may include a switch, such as a transistor, by which the charge storage device may be accessed. Data from a memory unit may be read by switching the transistor to determine whether charge is present in the charge storage device. Charge in the charge storage unit may also be drained during a read cycle.

Memory units having multiple transistors have been developed. However, such devices may not have a desirable reliability for reading data, or may take a larger area on a memory layout. Existing multi-transistor memory units may consume large amounts of power, take up large areas in a layout and have small fabrication yield. Existing three-transistor memory cells have capacitors with an electrode in the substrate and an electrode made of polycrystalline material. Other memory units include a complex stacked capacitor in a polycrystalline material directly above the substrate. Accordingly, the existing memory units having multiple transistors have a complex architecture that may be difficult to produce and have poor electrical properties.

Therefore, there is a need for a multi-transistor memory unit that may be constructed in a simple manner that is simple to produce with good electrical properties and a small layout area.

The present invention includes a memory cell having a simple architecture that may be constructed in a simple manner. The memory unit provides desirable electrical properties, uses small area layout, and consumes a low amount of power. A memory unit of the present invention may also be manufactured with a high fabrication yield.

The storage capacitor of the memory cell according to the present invention includes one or more electrode. In an embodiment, each of the electrodes is metallic. The metallic electrodes may be arranged in a metallization layer (i.e., above the transistors of the memory cell). The metallic electrodes have better electrical properties than polycrystalline and monocrystalline semiconductor electrodes, in particular with regard to the electrical conductivity. Thus, the area per memory cell is relatively small or reduced.

Regions of the transistors, such as channel regions, may be arranged in a semiconductor substrate such as a silicon substrate material. The electrodes may be positioned at mutually different distances from the substrate part containing the regions of the transistors. The electrodes of the capacitor may also be arranged parallel to one another and parallel to a substrate surface region of the memory cell.

In an embodiment, the memory cell includes, with increasing distance from the substrate part, in the order specified: 1) a first electrode; 2) a second electrode; 3) a third electrode; and 4) a fourth electrode. Two or more capacitor electrode pairs are thus arranged one above another. Thus, the chip area for a memory cell has a reduced dependency on the total capacitance of the storage capacitor. The first electrode and the third electrode may be electrically conductively connected to one another to form an electrode group. The second electrode and the fourth electrode are likewise electrically conductively connected to one another to form a further electrode group. Accordingly, a simple-to-connect arrangement of intermeshing electrode groups is provided. When the electrodes of an electrode group have an identical thickness and the electrodes of different electrode groups have different thicknesses, then the storage capacitor may have desirable electrical properties, particularly when thinner electrodes are connected to a constant potential. Electrodes having different thicknesses are preferred particularly when the electrodes are arranged in different metallization layers.

In an embodiment, the storage capacitor includes at least two metallic electrodes arranged between two mutually adjacent metallization layers, such as between planar metallization layers. The storage capacitor with at least two metallic electrodes arranged between two mutually adjacent metallization layers may be combined with stacking electrodes one above another in different metallization layers, to increase the total area capacitance of the capacitor.

The metallic electrode may be a pure metal or include more than 50 percent by weight of atoms of a metal. The metal may be titanium nitride, tantalum nitride, tantalum, titanium, tungsten nitride, aluminum, aluminum alloy, copper, copper alloy, tungsten, gold or silver and combinations thereof. The electrodes may have a square or rectangular contour or cross-section. In particular, there are no convex comers to partial regions of the electrodes whose area amounts to more than ten percent of the square or rectangular contour area. The electrodes having the simple basic form are simple to produce and have low leakage currents.

A capacitor dielectric may include silicon oxide, such as silicon dioxide, silicon nitride, silicon carbide, aluminum oxide, aluminum trioxide, tantalum oxide, tantalum pentoxide, hafnium oxide, hafnium dioxide, zirconium oxide, zirconium dioxide, lead zirconate titanate, barium strontium titanate. Many of these materials have a relative permittivity of greater than 8. In connection with a thickness of the capacitor dielectric in the range of 50 nm to 5 nm, it is possible even with a pair of plates to obtain high area capacitance values (e.g. greater than 2 fF/μm 2 (femtofarad per square micrometer). In an embodiment, the capacitance of the capacitor may be in the range of about 10 fF to about 0.5 fF. In another embodiment, the capacitance may be about 1 fF.

The capacitor may include not only an electrode area or electrode partial area lying parallel to a substrate, but also at least one electrode area or electrode partial area arranged transversely with respect to the substrate and which contributes substantially to the total capacitance. Thus, by way of example, at least ten percent of the capacitance is provided by transverse electrode areas. Such a U-shaped or V-shaped electrode is explained e.g. in the European patent application EP 1277229, which is incorporated in its entirety by reference herein.

In an embodiment, a conductive section for lateral current transport within the metallization layer in which the conductive section is arranged is provided between the storage capacitor and the substrate. An electrically conductive connection lies between the conductive section and a connection of a transistor. A further electrically conductive connection lies between the conductive section and a connection of another transistor of the memory cell. There is preferably a single electrically conductive connection between the conductive section and the capacitor. The conductive section enables a reliable connection of two transistors to the storage capacitor.

A memory unit according to the invention includes multiple memory cells, each having multiple transistors according to the invention and developments therefrom. The abovementioned technical effects thus also apply to a memory unit.

In an embodiment of a memory unit, electrodes for different memory cells are formed as a collective electrode. The collective electrode is formed in a word line direction as an electrode for a plurality of memory cells on different bit lines. In the bit line direction, the collective electrode is not assigned a plurality of memory cells. Alternatively, the collective electrode is formed in a bit line direction as an electrode for a plurality of memory cells on different word lines and the collective electrode is not assigned a plurality of memory cells in the word line direction. Thus degrees of freedom for the design may be achieved and specific circuitry requirements fulfilled more easily.

In another embodiment for a memory unit, the collective electrode is formed as an electrode both in a word line direction for memory cells on a plurality of bit lines and in a bit line direction for memory cells on a plurality of word lines (e.g., for some of the memory cells of the memory unit but not for all of the memory cells of the memory unit). The number of word lines associated with the collective electrode is equal to the bit width of a word line decoder. Alternatively, the number of bit lines associated with the collective electrode is equal to the bit width of a bit line decoder of the memory unit. Accordingly, current consumption may be reduced, particularly when the memory cells on a word line are connected to a plurality of bit line decoders or the memory cells on a bit line are connected to a plurality of word line decoders.

The collective electrode is preferably connected outside a memory cell array for a plurality of memory cells, without local electrically conductive connections existing for individual memory cells to relieve a burden on the design in the memory cell array. Alternatively, the collective electrode includes at least one connection for each memory cell, resulting in a good contact-connection and a uniform potential at the collective electrode.

In a next development, the storage capacitors for all the memory cells are arranged at—among one another—a substantially identical distance from the transistors of the relevant memory cell, and preferably in the same metallization layers. A number of production steps is thus reduced. Alternatively, the storage capacitors for different memory cells are arranged at—among one another—a different distance from the transistors of the relevant memory cell, and preferably in different metallization layers. Accordingly, the capacitors of mutually adjacent memory cells may be arranged in overlapping fashion, and the layout area decreased. The design may be applied both to capacitors having only one pair of electrodes and to capacitors having more than two electrodes.

In another embodiment, a capacitor of a memory cell is arranged closer to a semiconductor substrate of the memory unit than a bit line for driving the memory cell. The capacitor can thereby be connected more simply. As an alternative, the capacitor of a memory cell is arranged further away from the semiconductor substrate than the bit line. Cutouts in the electrodes of the capacitor for the connection of the bit line can be obviated in this case.

Exemplary embodiments of the invention are explained below with reference to the accompanying drawings. Identical, functionally identical, or similar elements and signals are referred to with the same reference symbols in the figures unless stated otherwise.

FIG. 1 shows a three-transistor memory cell.

FIG. 2 shows a plan view of a layout of the memory cell.

FIG. 3 shows a cross section through I-I of the layout of the memory cell shown in FIG. 2 .

FIG. 4 shows an exemplary embodiment with storage capacitors arranged in one plane.

FIG. 5 shows an exemplary embodiment with storage capacitors arranged in a plurality of planes.

FIG. 6 shows an exemplary embodiment with individual capacitors connected in parallel.

FIG. 7 shows an exemplary embodiment with a multilayer capacitor.

FIG. 8 shows a plan view of an exemplary embodiment with a bottom collective electrode.

FIG. 9 shows a cross section through an exemplary embodiment with a top collective electrode.

FIG. 10 shows an exemplary embodiment with a plurality of collective electrodes.

FIG. 11 shows a further exemplary embodiment with a plurality of collective electrodes.

FIG. 1 shows a circuit diagram of a memory cell 10 having three transistors T 1 to T 3 and a capacitor Cs. In the exemplary embodiment, the transistors T 1 to T 3 are n-channel transistors. The capacitor Cs may be a metal insulator metal (“MIM”) capacitor. The circuit of the memory cell 10 includes a subcircuit for writing and a subcircuit for reading. The charge of the capacitor Cs is not altered during reading, so that there is no need either for the charge to be refreshed after a reading operation.

The subcircuit for writing includes the writing transistor T 1 and the capacitor Cs. A gate of the transistor T 1 is connected to a writing word line WWL. A drain of the transistor T 1 is connected to a writing bit line BL 1 . The source connection of the transistor T 1 leads to a memory node X formed by an electrode of the capacitor Cs. The other electrode of the capacitor Cs is at a ground potential VSS.

The subcircuit for reading includes transistors T 2 and T 3 . A gate of the transistor T 3 is connected to a reading word line RWL. Word lines are thus connected to a gate connection of a transistor T 1 or T 3 . A source of the transistor T 3 is connected to a reading bit line BL 2 , which is charged to an operating potential VDD. The reading bit line BL 2 may be charged to an operating potential before the beginning of the reading operation. A drain of the transistor T 3 is connected to one source connection of the transistor T 2 . A gate of the transistor T 2 is connected to the memory node X. A drain of the transistor T 2 is at the ground potential VSS.

The transistor T 2 may be an amplifier. As an amplifier, transistor T 2 provides for reliable reading, such as in the event of charge losses at memory node X. When a positive charge is placed on the memory node X, then the transistor T 2 is in the switched-on state, and the precharged reading bit line BL 2 is discharged during the reading operation.

FIG. 2 shows a plan view of a layout of the memory cell 10 . FIG. 3 shows a cross section through I-I of the layout of the memory cell 10 . The memory cell 10 is produced proceeding from a silicon substrate 12 . The substrate 12 includes insulation regions 14 , 16 . The substrate 12 may also include n-doped channel connection zones of the transistors T 1 to T 3 , such as:

a source region 20 of the transistor T 3 , a doping region 22 , which forms the drain region of the transistor T 3 and the source region of the transistor T 2 , a drain region 24 of the transistor T 2 , a source region 26 of the transistor T 1 , and a drain region 28 of the transistor T 1 .

With increasing distance from the substrate 12 , the following may be arranged in the memory cell:

in a plane “gate”, the reading word line RWL, the writing word line WWL and the gate 30 of the transistor T 2 , all having of a polycrystalline silicon, in a plane “contact”, contacts W 1 to W 5 , for example made of tungsten, the contact W 1 leading to the drain region 28 , the contact W 2 leading to the source region 26 , the contact W 3 leading to the gate 30 , the contact W 4 leading to the drain region 24 and the contact W 5 leading to the source region 20 , in a planar metallization layer m 1 , a pad 32 (landing pad) connected to the contact W 1 , a pad 34 connected to the contacts W 2 and W 3 , a ground line Vss made of e.g. copper or made of a copper alloy, which runs in the word line direction and is connected to the contact W 4 , and a pad 36 connected to the contact W 5 , the pads comprising e.g. copper or a copper alloy, a via layer via 1 having a via 40 leading to the pad 34 , a via 41 leading to the pad 32 , and a via 42 leading to the pad 36 , a planar metallization layer m 2 containing a pad 44 connected to the via 40 , and also containing the writing bit line BL 1 and the reading bit line BL 2 , the writing bit line BL 1 being connected to the via 41 and the reading bit line BL 2 being connected to the via 42 , a via layer via 2 containing a via 46 leading to the pad 44 , a planar metallization layer m 3 containing a pad 48 connected to the via 46 , a via layer via 3 containing a via 50 leading to the pad 48 , a metallization layer m 4 containing a pad 52 connected to the via 50 , a via layer via 4 containing a via 54 connected to the pad 52 , and a metallization layer m 5 containing a bottom electrode of the capacitor Cs.

The vias 40 to 54 may include copper or a copper alloy. To produce the metallization, multiple single damascene or dual damascene methods may be used in which, after the copper deposition, planarization is effected in each case using a chemical mechanical polishing (“CMP”) method. The metallization layer m 5 may additionally include a capacitor dielectric 58 adjoining the bottom electrode 56 and a top electrode 60 of the capacitor Cs, where the top electrode is arranged on the capacitor dielectric 58 .

FIG. 4 shows an exemplary embodiment with storage capacitors C 1 to C 3 arranged in a plane and associated in an order of three-transistor memory cells S 1 , S 2 and S 3 , respectively. The three-transistor memory cells S 1 , S 2 , and S 3 may be are constructed similar to the memory cell 10 apart from the discrepancies explained below. Bottom electrodes of the capacitors C 1 to C 3 are arranged for example in the metallization layer m 2 and the bit lines BL 1 and BL 2 are routed in the metallization layer m 3 .

The bottom electrodes of the capacitors C 1 to C 3 may be connected from below. For example a connection that lies only within the metallization layers between the relevant capacitor C 1 to C 3 and a substrate 12 a may be provided. By contrast, the top electrodes of the capacitors C 1 to C 3 are connected from above for each memory cell S 1 to S 3 . The relevant connection may lead as far as the substrate 12 a and run through the metallization layers m 1 to m 4 . The memory cells S 1 to S 3 may lie on the same word lines or on the same bit lines. In an exemplary embodiment, the bottom electrodes of the capacitors C 1 to C 3 are thicker than the top electrodes of the capacitors C 1 to C 3 .

FIG. 5 shows an exemplary embodiment with storage capacitors C 11 , C 12 and C 13 arranged in multiple planes and associated in order with three-transistor memory cells S 11 , S 12 and S 13 , respectively. The transistor memory cells S 11 , S 12 , and S 13 are constructed similar to the memory cell 10 apart from the differences described herein. In an exemplary embodiment, the bottom electrode of the capacitor C 11 lies in the metallization layer m 2 . The bottom electrode of the capacitor C 12 lies in the metallization layer m 3 . The bottom electrode of the capacitor C 13 lies in the metallization layer m 1 , such as in the metallization layer that is at the least distance from a substrate 12 c.

The bottom electrodes of the capacitors C 11 to C 13 are connected from below, such as by a connection that lies only within the metallization layers between the relevant capacitor C 11 to C 13 and the substrate 12 b. By contrast, the top electrodes of the capacitors C 11 to C 13 are connected from above for each memory cell S 11 to S 13 , where the relevant connection leads as far as the substrate 12 b and running through the metallization layers m 1 to m 4 . The memory cells S 11 to S 13 may lie on the same word lines or on the same bit lines. The bottom electrodes of the capacitors C 11 to C 13 may be thicker than the top electrodes of the capacitors C 11 to C 13 . The capacitors C 12 and C 13 are arranged in a manner overlapping one another in a direction of the normal to a surface 70 of the substrate 12 b, so that they in each case also overlap an area of the substrate which is associated with the other memory cell. The arrangement of three types of memory cells S 11 to S 13 as illustrated in FIG. 5 is continued toward the left in another exemplary embodiment (e.g., dots 72 ), thereby giving rise to a sequence m 2 , m 3 , m 1 , m 2 , m 3 etc. of the bottom electrodes in the metallization layers. Other sequences are used in other exemplary embodiments.

FIG. 6 shows an exemplary embodiment with three parallel-connected individual capacitors C 21 a to C 21 c and C 22 a to C 22 c per memory cell S 21 and S 22 , respectively. The memory cells S 21 and S 22 may be constructed like the memory cell 10 apart from the differences described below. For simplifying the description, only the construction of the memory cell S 21 is explained herein.

In the exemplary embodiment, the bottom electrode of the capacitor C 21 a lies in the metallization layer m 1 . The bottom electrode of the capacitor C 21 b lies in the metallization layer m 2 . The bottom electrode of the capacitor C 21 c lies in the metallization layer m 3 , such as in the metallization layer that is at the greatest distance from a substrate 12 c. The capacitors of the memory cell S 21 are arranged in a manner overlapping one another with regard to the direction of the normal to a surface 80 of the substrate 12 c, a uniform offset preferably occurring between adjacent capacitors.

The bottom electrodes of the capacitors C 21 a to C 21 c are connected from below, such as by a connection that lies only within the metallization layers between the relevant capacitor C 21 a to C 21 c and the substrate 12 b. By contrast, the top electrodes of the capacitors C 21 a to C 21 c are connected from above, the relevant connection leading as far as the substrate 12 c. The memory cells S 21 and S 22 may lie on the same word lines or on the same bit lines. In the exemplary embodiment, the bottom electrodes of the capacitors C 21 a to C 22 c are thicker than the top electrodes of the capacitors C 21 a to C 22 c. The arrangement shown with reference to FIG. 6 results in a higher capacitance over the basic area predefined per memory cell S 21 , S 22 . As an alternative to the planar capacitors in accordance with FIGS. 4-6 , U-shaped or V-shaped MIM capacitors are used in other exemplary embodiments.

FIG. 7 shows an exemplary embodiment with a multilayer capacitor C 30 that is used in place of the capacitors C 1 to C 22 c shown in FIGS. 4-6 . Multiple metallic electrodes E 1 to E 4 may lie between two metallization layers, such as between the metallization layers m 2 and m 3 . The bottom electrode E 1 and the upper middle electrode E 3 form an electrode pair E 1 , E 3 having electrically conductively interconnected electrodes. The lower middle electrode E 2 and the topmost electrode E 4 form a further electrode pair E 2 , E 4 , which likewise includes connected electrodes E 2 and E 4 . The electrode pair E 1 , E 3 is connected to one connection A 1 of the capacitor C 30 . The electrode pair E 2 , E 4 is connected to the other connection A 2 of the capacitor. The electrodes of the electrode pairs may alternate between two metallization layers with increasing distance from the substrate. Lying between adjacent electrodes is a thin dielectric D 1 to D 3 , etc. The thin dielectric may be a material having a relative permittivity of greater than 8. In another exemplary embodiment, the bottom electrode of the capacitor C 30 is made thicker in the metallization layer m 3 than the electrode adjoining above the latter. A thick electrode in the metallization layer m 3 may also be included with the capacitor C 30 .

The connection of the electrodes of the capacitor can be effected from the substrate, as illustrated in FIG. 7 . However, in another exemplary embodiment, the electrodes E 1 to E 4 are connected from “above”, such as at their sides remote from the substrate. In a next exemplary embodiment, the electrodes of an electrode pair may be connected at mutually different sides, such as from “above.” In further exemplary embodiments, the capacitor C 30 includes only three electrodes or more than four electrodes (e.g., five, six seven or more electrodes).

FIG. 8 shows a plan view of an exemplary embodiment with a capacitor C 40 having a bottom collective electrode E 10 for multiple memory cells S 40 to S 46 , such as for four memory cells that are each constructed similar to the memory cell 10 except for the differences explained below. The collective electrode E 10 carries ground potential Vss. The capacitor C 40 has a plurality of top electrodes E 40 , E 42 , E 44 and E 46 assigned in this order to the memory cells S 40 , S 42 , S 44 and S 46 . The memory cells S 42 to S 46 are arranged alongside the capacitor C 40 . For example, the memory cells S 42 to S 46 are arranged in a lateral direction relative to the active surface of a substrate. The arrangement shown in FIG. 8 also enables a space-saving MIM capacitor to be produced. In particular, the bottom electrode may be connected outside the cell array.

FIG. 9 shows a cross section through an exemplary embodiment with a capacitor containing a top collective electrode E 48 and a plurality of bottom electrodes E 50 and E 52 that are assigned in this order to two memory cells S 50 and S 52 , respectively. The memory cells 50 and 52 are in each case constructed like the memory cell 10 apart from the differences explained. The arrangement illustrated in FIG. 9 enables a space-saving MIM capacitor to be produced. In particular, the top electrode E 48 may be connected outside the cell array.

The collective electrodes illustrated in FIGS. 8 and 9 may be assigned to multiple memory cells in the word line direction or in the bit line direction. In each case, the memory cells driven by a writing word line or reading word line, or the memory cells driven by a writing bit line or reading bit line being may be assigned to the collective electrode. Multiple memory cells may be arranged on a collective electrode both in the word line direction and in the bit line direction (see e.g., FIG. 8 or FIGS. 9 and 10 explained below).

FIG. 10 shows a memory unit 100 having eight collective electrodes S 100 to S 114 that are respectively assigned to one of eight bit line decoders BD 0 to BD 14 . A collective electrode S 100 to S 114 extends over three-transistor memory cells assigned to seven different word line decoders WD 0 to WD 12 . The bit width of the bit line decoders BD 0 to BD 14 and of the word line decoders WD 0 to WD 12 is four bits in the exemplary embodiment. Consequently, 112 memory cells lie below a collective electrode in the exemplary embodiment. Multiplexers that are not illustrated ensure that, depending on an address datum, only in each case one bit line decoder BD 0 to BD 14 and only in each case one word line decoder WD 0 to WD 12 are active.

In other exemplary embodiments, the memory unit 100 may have a different organizational structure, such as a different number of word line decoders or bit line decoders, or a different bit width of the decoders. In other exemplary embodiments, the bit width may be two bits, eight bits, sixteen bits or more.

The assignment of the collective electrodes S 100 to S 114 to a respective bit line decoder BD 0 to BD 14 allows a considerable reduction of the current consumption of the memory unit 100 when a potential is applied only to that collective electrode S 100 to S 114 having a bit line decoder BD 0 to BD 14 that is currently selected. By contrast, the non-selected collective electrodes BD 0 to BD 14 are not connected to the operating potential or the ground potential.

FIG. 11 shows a memory unit 110 having seven collective electrodes S 200 to S 212 that are respectively assigned to one of seven word line decoders WD 10 to WD 22 . A collective electrode S 200 to S 212 extends over three-transistor memory cells that are assigned to six different bit line decoders BD 10 to BD 20 . The bit width of the bit line decoders BD 10 to BD 20 , and of the word line decoders WD 10 to WD 22 , is four bits in the exemplary embodiment. Consequently, 96 memory cells lie below a collective electrode S 200 to S 212 in the exemplary embodiment. Multiplexers that are not illustrated ensure that, depending on an address datum, only in each case one bit line decoder BD 10 to BD 20 and only in each case one word line decoder WD 10 to WD 22 are active.

In other exemplary embodiments, the memory unit 110 has a different organizational structure, such as a different number of word line decoders or bit line decoders or a different bit width of the decoders. In other exemplary embodiments, the bit width may be two bits, eight bits, sixteen bits or more.

The assignment of the collective electrodes S 200 to S 212 to a respective word line decoder WD 10 to WD 22 reduces the current consumption of the memory unit 110 when a potential is applied such as only to the collective electrode S 200 to S 212 having a word line decoder that is currently selected. By contrast, the non-selected collective electrodes are not connected to the operating potential or the ground potential.

The present invention specifies space-saving or chip-area-saving variants of three-transistor SRAM cells (3T) and of one-transistor SRAM cells (1T). The memory cells of the present invention may have applicability more for logic chips (e.g. microcontrollers, microprocessors, telecommunication chips, etc.) that have ever increasing use of larger on-chip memories, even in examples where typical SRAM memories may utilize more chip area compared with the digital logic.

The memory cells may have a capacitance shifted into the metallization. In particular, MIM capacitances with high-k dielectrics are distinguished by high area capacitance densities that may amount to up to 26 fF per square micrometer. (see P. Mazoyer et al., IITC2003, page 117). Capacitances in the range of 1 fF with less than 0.05 square micrometer may be possible, if an area capacitance of 25 fF per square micrometer is achieved. Moreover, concepts for further reducing the area requirement and for realizing collective electrodes are specified.

The materials used for the MIM capacitors are deposited and subjected to heat treatment at the temperatures of less than 450° C. (degrees Celsius) that are typical for metallizations, although the maximum values for the relative permittivity are not then attained for all the dielectrics, in particular not for all the dielectrics mentioned. In particular, the exemplary embodiments with collective electrodes can be applied both to storage capacitors having only two electrodes in each case and to storage capacitors having more than two electrodes or to a plurality of storage capacitors that are connected in parallel and arranged one above another per memory cell. In particular, the collective electrodes are the top electrodes.