Inventor

MAKOTO KASHIWAGI

Inventor
JP

Overview

21→
Patents
2021–2026
Patent span
Performing operations
Primary field (CPC B)

Patents· 21 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B24Bprimary
B24BMachines, devices, or processes for grinding or polishing28%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
H01LSemiconductor devices15%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices5%
C23CCoating metallic material3%
LOC133%
B08BCleaning in general2%
B22FWorking metallic powder2%
B23PMetal-working not otherwise provided for2%
B24CAbrasive or related blasting with particulate material2%
PatentTitleYear
D1119829Seal for chemical mechanical polishing device2026D1102398Seal for chemical mechanical polishing device202512,406,874Substrate holding apparatus, substrate processing apparatus having substrate holding apparatus, and substrate processing method202512,377,516Polishing head and polishing apparatus202512,237,194Substrate transporter and substrate processing apparatus including substrate transporter202512,002,704Substrate holding apparatus, substrate processing apparatus having substrate holding apparatus, and substrate processing method202411,865,665Polishing apparatus202411,858,487Brake control apparatus and method for detecting abnormality in brake control apparatus202411,804,398Workpiece supporting apparatus and workpiece supporting method202311,701,750Top ring for holding a substrate and substrate processing apparatus202311,697,184Substrate processing apparatus and substrate processing method202311,638,980Laminated membrane, substrate holder including laminated membrane, and substrate processing apparatus202311,511,386Polishing apparatus and polishing method202211,511,389Polishing head and polishing apparatus202211,456,406Silicon bulk thermoelectric conversion material202211,400,561Top ring for holding a substrate and substrate processing apparatus202211,370,080Polishing head for holding substrate and substrate processing apparatus202211,335,588Substrate holding apparatus and substrate processing apparatus202211,331,768Polishing head and polishing apparatus202211,305,399Jig for a polishing apparatus202211,180,853Substrate processing apparatus and substrate processing method2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2026Patents assigned to EBARA CORP (19)· patent assignee history
2021–2026Based in JP· patent location history
2022Patents assigned to JAPAN SCIENCE & TECH AGENCY (1)· patent assignee history
2024Patents assigned to HITACHI ASTEMO LTD (1)· patent assignee history
2024Patents assigned to HITACHI AUTOMOTIVE SYSTEMS LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
EBARA CORP192021–2026
HITACHI ASTEMO LTD12024
HITACHI AUTOMOTIVE SYSTEMS LTD12024
JAPAN SCIENCE & TECH AGENCY12022
Locations
LocationPatentsSpan
JP212021–2026