The article is a seal for a top ring of a chemical mechanical polishing device. The feature of the design resides in the shape and configuration of the article as shown in the reproductions. Reproduction 1 . 8 is an enlarged cross-sectional view taken along the line 1 . 8 - 1 . 8 in Reproduction 1 . 4 . Reproduction 1 . 9 is an enlarged view of a portion 1 . 9 of the article in Reproduction 1 . 8 . The broken lines shown in Reproduction 1 . 10 illustrate environmental subject matter and form no part of the claimed design. Additionally, the dash-dot broken lines are for the purpose of illustrating the enlarged views and form no part of the claimed design.

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Claims

1 · 1 independent · depth 1

1 granted claims

›1.independentThe ornamental design for a seal for chemical mechanical polishing device as shown and described.

Classifications

2 codes

USPC · US Patent Classification

D13/182D15/126

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Pendency

2.5 y

910 days filing → grant

Office actions

non-final + final

Responses

no RCE

Examiner

Rhea Shields

art unit 2917 · TC 2900

Law firm

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Citations: 21 back · 0 forward

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Worldwide family

3 members · 3 offices

this patentIP5 & PCTother officessolid = grantedhover for detail · click to open

Members

DOCDB simple family 88327915

Offices

US · JP

Granted

2 of 3

grant date present

Non-English titles

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›IP5 & PCT — 2 members

Office	Publication	Kind	Published	Filed	Status	Title
USthis patent	US-D1119829-S	S1	24 Mar 2026	26 Sep 2023	granted	Seal for chemical mechanical polishing device
JP	JP-1755378-S	S	16 Oct 2023	30 Mar 2023	granted	化学的機械研磨装置用シール材ja

›Other offices — 1 members

Office	Publication	Kind	Published	Filed	Status	Title
TW	TW-D232106-S	S	1 Jul 2024	26 Sep 2023	published	化學性機械研磨裝置用密封材zh

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