Inventor
Daiyu Kondo
Inventor
Kawasaki, JP
Overview
Patents· 26 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
B82YSpecific uses or applications of nanostructures11%
H01LSemiconductor devices11%
Y10TTechnical subjects covered by former us classification9%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests8%
C01BNon-metallic elements7%
H10DInorganic electric semiconductor devices5%
B01JChemical or physical processes, e.g. catalysis or colloid chemistry4%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application4%
PatentTitleYear
10,770,370Electronic device and heat dissipating sheet202010,497,639Carbon nanotube structure, heat dissipation sheet, and method of manufacturing carbon nanotube structure201910,381,290Method of manufacturing an electronic device201910,079,209Graphene film manufacturing method and semiconductor device manufacturing method20189,865,699'Semiconductor device and method of manufacturing the same'20189,576,907'Wiring structure and method of manufacturing the same'20179,537,075'Graphite structure, electronic component and method of manufacturing electronic component'20179,385,209'Semiconductor device and method of manufacturing the same'20169,355,916'Semiconductor manufacturing method and semiconductor device'20169,085,831'Bundle of long thin carbon structures, manufacturing method therefor, and electronic device'20158,958,207'Heat radiation material, electronic device and method of manufacturing electronic device'20158,932,904'Semiconductor device and method of manufacturing the same'20158,749,979'Sheet structure and method of manufacturing sheet structure'20148,743,546'Sheet structure and method of manufacturing the same'20148,632,885'Bundle of long thin carbon structures, manufacturing method thereof, and electronic device'20148,533,945'Wiring structure and method of forming the same'20138,501,321'Bundle of long thin carbon structures, manufacturing method thereof, and electronic device'20138,372,487'Carbon nanotube device and manufacturing method of the same'20138,350,391'Sheet structure, semiconductor device and method of growing carbon structure'20138,258,060'Sheet structure, semiconductor device and method of growing carbon structure'20128,194,407'Heat radiation material, electronic device and method of manufacturing electronic device'20128,076,260'Substrate structure and manufacturing method of the same'20118,071,216'Bundle of long thin carbon structures, manufacturing method thereof, and electronic device'20118,029,760'Method of manufacturing carbon nanotube'20117,932,510'Carbon nanotube grown on catalyst and manufacture method'20117,417,320'Substrate structure and manufacturing method of the same'2008Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2008–2020Patents assigned to FUJITSU LTD (22)· patent assignee history
2008–2018Based in Kawasaki, JP· patent location history
2011–2017Patents assigned to KONDO DAIYU (13)· patent assignee history
2012–2017Patents assigned to IWAI TAISUKE (7)· patent assignee history
2012–2015Patents assigned to SOGA IKUO (6)· patent assignee history
2012–2015Patents assigned to YAMAGUCHI YOSHITAKA (6)· patent assignee history
2016–2020Based in Atsugi, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FUJITSU LTD | 22 | 2008–2020 |
| KONDO DAIYUself | 13 | 2011–2017 |
| IWAI TAISUKE | 7 | 2012–2017 |
| SOGA IKUO | 6 | 2012–2015 |
| YAMAGUCHI YOSHITAKA | 6 | 2012–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kawasaki, JP | 20 | 2008–2018 |
| Atsugi, JP | 6 | 2016–2020 |