In the bundle of long thin carbon structures of the present invention, end parts of the bundle are interconnected in a carbon network. The interconnected end parts form a flat surface. By this, an electrical connection structure with low resistance and/or a thermal connection structure with high thermal conductivity are obtained. The bundle of long thin carbon structures can be used suitably as a via, heat removal bump or other electronic element.

Claims

20 · 3 independent · depth 3

20 granted claims

›1.independentA bundle of a plurality of carbon nanotubes formed with a first group of end parts of said plurality of carbon nanotubes on a substrate and a second g…+7

›2.↳ 1The bundle according to claim 1, wherein the interconnected end parts and middle parts of the bundle of carbon nanotubes are connected electrically or…d2+1

›4.↳ 1The bundle according to claim 1, wherein each of the carbon nanotubes is a single long thin carbon structure extending from its interconnected end par…d2

›5.↳ 1The bundle according to claim 1, wherein each of the carbon nanotubes is a single multilayer carbon nanotube extending from its interconnected end par…d2

›6.↳ 1The bundle according to claim 1, wherein the interconnected end parts are polished.d2

›7.↳ 1An electronic device using the bundle according to claim 1 as an electrically conductive material or thermally conductive material, or electrically an…d2+1

›9.independentA method for manufacturing a bundle of a plurality of carbon nanotubes by chemical vapor deposition, wherein a first group of end parts opposite to a …+8

›10.↳ 9The method for manufacturing the bundle according to claim 9, wherein the flat carbon network and middle parts of the bundle of the plurality of carbo…d2+1

›12.↳ 9The method for manufacturing the bundle according to claim 9, wherein each of the carbon nanotubes is a single long thin carbon structure extending fr…d2

›13.↳ 9The method for manufacturing the according to claim 9, wherein each of the carbon nanotubes is a single multilayer carbon nanotube extending from the …d2

›14.↳ 9The method for manufacturing the bundle according to claim 9, wherein the carbon nanotubes are synthesized from the catalytic thin film on the catalys…d2+2

›17.↳ 9The method for manufacturing the bundle according to claim 9, wherein a thickness of the catalyst thin film is 0.5-2 nm and a thickness of the catalys…d2

›18.independentAn electronic device comprising:na plurality of carbon nanotubes with a first group of ends thereof fixed to a substrate; andgraphite formed by chemic…+2

Classifications

3 codes

IPC · International Patent Classification

Section B — Performing operations; transporting

B32B9/00

USPC · US Patent Classification

428/408423/447.1

Claim changes

Soon

Coming soonHow the claims changed between publication and grant

See which claims were amended, added or cancelled during examination, with every added and removed word marked.

AmendedAddedCancelledUnchanged

The published claims of this patent are not paired with the granted ones in what we hold.

File wrapper

Pendency

4.0 y

1,464 days filing → grant

Office actions

non-final + final

Responses

5 RCE

Interviews

examiner interview summaries

Examiner

Daniel H Miller

art unit —

Law firm

Law firm · Log in to unlock

Citations: 9 back · 0 forward

See the full prosecution history — every USPTO and applicant action on this file, in order.

Term & fees

See the term timeline — pendency span, in-force span, the maintenance fees paid and both computed expiry dates.

Priority chain

1 priority documents

›Priority documents — 1

Type	Document	Date
related publication	US 20080131352 A1	5 Jun 2008

Validity challenges

See the validity challenges on record — reexaminations, IPRs and PGRs, with their institution decisions and outcomes.

Citations

See every patent this one cites and every patent that cites it back — publication, assignee, and how each one was found.