In the bundle of long thin carbon structures of the present invention, end parts of the bundle are interconnected in a carbon network. The interconnected end parts form a flat surface. By this, an electrical connection structure with low resistance and/or a thermal connection structure with high thermal conductivity are obtained. The bundle of long thin carbon structures can be used suitably as a via, heat removal bump or other electronic element.

Claims

20 · 3 independent · depth 3

20 granted claims

›1.independentA bundle of a plurality of carbon nanotubes formed with a first group of end parts of said plurality of carbon nanotubes on a substrate and a second g…+7

›2.↳ 1The bundle according to claim 1, wherein the interconnected end parts and middle parts of the bundle of carbon nanotubes are connected electrically or…d2+1

›4.↳ 1The bundle according to claim 1, wherein each of the carbon nanotubes is a single long thin carbon structure extending from its interconnected end par…d2

›5.↳ 1The bundle according to claim 1, wherein each of the carbon nanotubes is a single multilayer carbon nanotube extending from its interconnected end par…d2

›6.↳ 1The bundle according to claim 1, wherein the interconnected end parts are polished.d2

›7.↳ 1An electronic device using the bundle according to claim 1 as an electrically conductive material or thermally conductive material, or electrically an…d2+1

›9.independentA method for manufacturing a bundle of a plurality of carbon nanotubes by chemical vapor deposition, wherein a first group of end parts opposite to a …+8

›10.↳ 9The method for manufacturing the bundle according to claim 9, wherein the flat carbon network and middle parts of the bundle of the plurality of carbo…d2+1

›12.↳ 9The method for manufacturing the bundle according to claim 9, wherein each of the carbon nanotubes is a single long thin carbon structure extending fr…d2

›13.↳ 9The method for manufacturing the according to claim 9, wherein each of the carbon nanotubes is a single multilayer carbon nanotube extending from the …d2

›14.↳ 9The method for manufacturing the bundle according to claim 9, wherein the carbon nanotubes are synthesized from the catalytic thin film on the catalys…d2+2

›17.↳ 9The method for manufacturing the bundle according to claim 9, wherein a thickness of the catalyst thin film is 0.5-2 nm and a thickness of the catalys…d2

›18.independentAn electronic device comprising:na plurality of carbon nanotubes with a first group of ends thereof fixed to a substrate; andgraphite as a flat, mutua…+2

Classifications

4 codes

IPC · International Patent Classification

Section B — Performing operations; transporting

B32B9/00

USPC · US Patent Classification

428/408977/742423/448

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Pendency

5.7 y

2,073 days filing → grant

Office actions

non-final + final

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5 RCE

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Daniel H Miller

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1 priority documents

›Priority documents — 1

Type	Document	Date
related publication	US 20080131352 A1	5 Jun 2008

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