Inventor

Gilbert Dewey

Inventor
Hillsboro, OR, US

Overview

228→
Patents
2006–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 228 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Dprimary
H10DInorganic electric semiconductor devices34%
H01LSemiconductor devices25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
B82YSpecific uses or applications of nanostructures7%
H10BElectronic memory devices3%
G11CStatic stores2%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests1%
H10NElectric solid-state devices not otherwise provided for1%
C30BSingle-crystal growth0%
PatentTitleYear
11,107,890FINFET transistor having a doped subfin structure to reduce channel to substrate leakage202111,101,376Non-planar transition metal dichalcogenide devices202111,101,377Transistor device with heterogeneous channel structure bodies and method of providing same202111,075,202Bottom fin trim isolation aligned with top gate for stacked device architectures202111,075,198Stacked transistor architecture having diverse fin geometry202111,049,773Art trench spacers to enable fin release for non-lattice matched channels202111,031,503Non-planar gate thin film transistor202111,031,482Gate electrode having a capping layer202111,017,843Thin film transistors for memory cell array layer selection202111,011,550Self-aligned top-gated non-planar oxide semiconductor thin film transistors202111,004,982Gate for a transistor202110,992,017Semiconductor package comprising chiplets disposed on a substrate which are electromagnetically coupled by dielectric waveguides and a computing networks formed therefrom202110,964,992Electromagnetic wave launcher including an electromagnetic waveguide, wherein a millimeter wave signal and a lower frequency signal are respectively launched at different portions of the waveguide202110,964,701Vertical shared gate thin-film transistor-based charge storage memory202110,964,820Vertical transistor devices and techniques202110,957,769High-mobility field effect transistors with wide bandgap fin cladding202110,950,733Deep gate-all-around semiconductor device having germanium or group III-V active layer202110,950,301Two transistor, one resistor non-volatile gain cell memory and storage element202110,930,679Thin film transistors with a crystalline oxide semiconductor source/drain202110,930,791Systems, methods, and apparatuses for implementing bi-layer semiconducting oxides in source and drain for low access and contact resistance of thin film transistors202110,903,364Semiconductor device with released source and drain202110,892,335Device isolation by fixed charge202110,886,408Group III-V material transistors employing nitride-based dopant diffusion barrier layer202110,879,365Transistors with non-vertical gates202010,878,889High retention time memory element with dual gate devices202010,872,660Resistive memory devices with transition metal dichalcogenide (TMD) materials as ballast resistors to control current flow through the devices202010,861,939Stiff quantum layers to slow and or stop defect propagation202010,847,656Fabrication of non-planar IGZO devices for improved electrostatics202010,847,619Supperlatice channel included in a trench202010,818,799Vertical transistor devices and techniques202010,818,793Indium-rich NMOS transistor channels202010,811,461Access transmission gate202010,797,150Differential work function between gate stack metals to reduce parasitic capacitance202010,784,170CMOS implementation of germanium and III-V nanowires and nanoribbons in gate-all-around architecture202010,770,593Beaded fin transistor202010,756,198Fermi-level unpinning structures for semiconductive devices, processes of forming same, and systems containing same202010,749,032Techniques for forming transistors including group III-V material nanowires using sacrificial group IV material layers202010,748,900Fin-based III-V/SI or GE CMOS SAGE integration202010,734,488Aluminum indium phosphide subfin germanium channel transistors202010,734,511High mobility asymmetric field effect transistors with a band-offset semiconductor drain spacer202010,727,339Selectively regrown top contact for vertical semiconductor devices202010,727,138Integration of single crystalline transistors in back end of line (BEOL)202010,707,319Gate electrode having a capping layer202010,693,008Cladding layer epitaxy via template engineering for heterogeneous integration on silicon202010,665,688Low Schottky barrier contact structure for Ge NMOS202010,659,046Local cell-level power gating switch202010,651,288Pseudomorphic InGaAs on GaAs for gate-all-around transistors202010,651,313Reduced transistor resistance using doped layer202010,644,111Strained silicon layer with relaxed underlayer202010,644,123Systems, methods, and apparatuses for implementing a high mobility low contact resistance semiconducting oxide in metal contact vias for thin film transistors202010,644,137III-V finfet transistor with V-groove S/D profile for improved access resistance202010,644,140Integrated circuit die having back-end-of-line transistors202010,636,912FINFET transistor having a tapered subfin structure202010,586,848Apparatus and methods to create an active channel having indium rich side and bottom surfaces202010,580,882Low band gap semiconductor devices having reduced gate induced drain leakage (GIDL)202010,580,865Transistor with a sub-fin dielectric region under a gate202010,573,717Selective epitaxially grown III-V materials based devices202010,559,683Apparatus and methods to create a buffer to reduce leakage in microelectronic transistors202010,546,858Low damage self-aligned amphoteric FINFET tip doping202010,541,305Group III-N nanowire transistors202010,529,808Dopant diffusion barrier for source/drain to curb dopant atom diffusion202010,497,814III-V semiconductor alloys for use in the subfin of non-planar semiconductor devices and methods of forming the same201910,483,353Transistor including tensile-strained germanium channel201910,461,193Apparatus and methods to create a buffer which extends into a gated region of a transistor201910,461,082Well-based integration of heteroepitaxial N-type transistors with P-type transistors201910,446,685High-electron-mobility transistors with heterojunction dopant diffusion barrier201910,431,690High electron mobility transistors with localized sub-fin isolation201910,411,122Semiconductor device having group III-V material active region and graded gate dielectric201910,411,007High mobility field effect transistors with a band-offset semiconductor source/drain spacer201910,403,733Dielectric metal oxide cap for channel containing germanium201910,388,764High-electron-mobility transistors with counter-doped dopant diffusion barrier201910,388,800Thin film transistor with gate stack on multiple sides201910,373,977Transistor fin formation via cladding on sacrificial core201910,347,767Transistor with a subfin layer201910,340,275Stackable thin film memory201910,340,374High mobility field effect transistors with a retrograded semiconductor source/drain201910,319,646CMOS implementation of germanium and III-V nanowires and nanoribbons in gate-all-around architecture201910,290,709Apparatus and methods to create an indium gallium arsenide active channel having indium rich surfaces201910,290,614Group III-N transistors for system on chip (SOC) architecture integrating power management and radio frequency circuits201910,263,074High voltage field effect transistors201910,263,079Apparatus and methods for forming a modulation doped non-planar transistor201910,249,742Offstate parasitic leakage reduction for tunneling field effect transistors201910,249,490Non-silicon device heterolayers on patterned silicon substrate for CMOS by combination of selective and conformal epitaxy201910,243,078Carrier confinement for high mobility channel devices201910,236,369Techniques for forming non-planar germanium quantum well devices201910,229,997Indium-rich NMOS transistor channels201910,211,208High-mobility semiconductor source/drain spacer201910,186,581Group III-N nanowire transistors201910,181,518Selective epitaxially grown III-V materials based devices201910,096,474Methods and structures to prevent sidewall defects during selective epitaxy201810,096,709Aspect ratio trapping (ART) for fabricating vertical semiconductor devices201810,090,405Semiconductor device having group III-V material active region and graded gate dielectric201810,084,058Quantum well MOSFET channels having lattice mismatch with metal source/drains, and conformal regrowth source/drains201810,084,043High mobility nanowire fin channel on silicon substrate formed using sacrificial sub-fin201810,074,718Non-planar semiconductor device having group III-V material active region with multi-dielectric gate stack201810,026,845Deep gate-all-around semiconductor device having germanium or group III-V active layer201810,020,371Contact techniques and configurations for reducing parasitic resistance in nanowire transistors20189,972,686Germanium tin channel transistors20189,947,780High electron mobility transistor (HEMT) and method of fabrication20189,934,976Methods of forming low interface resistance rare earth metal contacts and structures formed thereby20189,929,273'Apparatus and methods of forming fin structures with asymmetric profile'20189,911,835'Tunneling field effect transistors (TFETs) for CMOS architectures and approaches to fabricating N-type and P-type TFETs'20189,905,651'GE and III-V channel semiconductor devices having maximized compliance and free surface relaxation'20189,899,505'Conductivity improvements for III-V semiconductor devices'20189,876,014Germanium-based quantum well devices20189,871,106'Heterogeneous pocket for tunneling field effect transistors (TFETs)'20189,865,684'Nanoscale structure with epitaxial film having a recessed bottom portion'20189,853,107Selective epitaxially grown III-V materials based devices20179,818,870'Transistor structure with variable clad/core dimension for stress and bandgap'20179,818,847'Non-planar III-V field effect transistors with conformal metal gate electrode and nitrogen doping of gate dielectric interface'20179,812,574'Techniques and configurations for stacking transistors of an integrated circuit device'20179,799,759'Techniques for forming non-planar germanium quantum well devices'20179,768,269'Fermi-level unpinning structures for semiconductive devices, processes of forming same, and systems containing same'20179,748,338'Preventing isolation leakage in III-V devices'20179,698,013'Methods and structures to prevent sidewall defects during selective epitaxy'20179,691,857'Group III-N nanowire transistors'20179,685,508'High voltage field effect transistors'20179,685,381'Integrating VLSI-compatible fin structures with selective epitaxial growth and fabricating devices thereon'20179,666,492'CMOS implementation of germanium and III-V nanowires and nanoribbons in gate-all-around architecture'20179,666,583'Methods of containing defects for non-silicon device engineering'20179,653,548'Non-planar semiconductor device having group III-V material active region with multi-dielectric gate stack'20179,653,559'Methods to enhance doping concentration in near-surface layers of semiconductors and methods of making same'20179,640,622'Selective epitaxially grown III-V materials based devices'20179,640,646'Semiconductor device having group III-V material active region and graded gate dielectric'20179,640,537'Non-silicon device heterolayers on patterned silicon substrate for CMOS by combination of selective and conformal epitaxy'20179,640,671'Deep gate-all-around semiconductor device having germanium or group III-V active layer'20179,634,007'Trench confined epitaxially grown device layer(s)'20179,583,602'Tunneling field effect transistors (TFETs) for CMOS architectures and approaches to fabricating N-type and P-type TFETs'20179,570,614'Ge and III-V channel semiconductor devices having maximized compliance and free surface relaxation'20179,564,490'Apparatus and methods for forming a modulation doped non-planar transistor'20179,478,635'Germanium-based quantum well devices'20169,461,141'Contact techniques and configurations for reducing parasitic resistance in nanowire transistors'20169,461,160'Non-planar III-N transistor'20169,455,150'Conformal thin film deposition of electropositive metal alloy films'20169,443,936'Quantum well MOSFET channels having lattice mismatch with metal source/drains, and conformal regrowth source/drains'20169,437,706'Method of fabricating metal-insulator-semiconductor tunneling contacts using conformal deposition and thermal growth processes'20169,412,872'N-type and P-type tunneling field effect transistors (TFETs)'20169,397,188'Group III-N nanowire transistors'20169,391,181'Lattice mismatched hetero-epitaxial film'20169,343,574'Non-planar semiconductor device having group III-V material active region with multi-dielectric gate stack'20169,337,291'Deep gate-all-around semiconductor device having germanium or group III-V active layer'20169,287,380'Gate electrode having a capping layer'20169,263,557'Techniques for forming non-planar germanium quantum well devices'20169,257,346'Apparatus and methods for forming a modulation doped non-planar transistor'20169,245,989'High voltage field effect transistors'20169,240,410'Group III-N nanowire transistors'20169,236,476'Techniques and configuration for stacking transistors of an integrated circuit device'20169,219,135'Germanium-based quantum well devices'20159,153,671'Techniques for forming non-planar germanium quantum well devices'20159,136,343'Deep gate-all-around semiconductor device having germanium or group III-V active layer'20159,123,567'CMOS implementation of germanium and III-V nanowires and nanoribbons in gate-all-around architecture'20159,123,790'Contact techniques and configurations for reducing parasitic resistance in nanowire transistors'20159,112,028'Methods of containing defects for non-silicon device engineering'20159,054,190'Methods of containing defects for non-silicon device engineering'20159,029,835'Epitaxial film on nanoscale structure'20159,018,680'Non-planar semiconductor device having active region with multi-dielectric gate stack'20158,952,541'Method of fabricating metal-insulator-semiconductor tunneling contacts using conformal deposition and thermal growth processes'20158,936,976'Conductivity improvements for III-V semiconductor devices'20158,901,740'Method of fabricating metal-insulator-semiconductor tunneling contacts using conformal deposition and thermal growth processes'20148,890,264'Non-planar III-V field effect transistors with conformal metal gate electrode and nitrogen doping of gate dielectric interface'20148,890,118'Tunnel field effect transistor'20148,890,120'Tunneling field effect transistors (TFETs) for CMOS approaches to fabricating N-type and P-type TFETs'20148,878,363'Fermi-level unpinning structures for semiconductive devices, processes of forming same, and systems containing same'20148,872,160'Increasing carrier injection velocity for integrated circuit devices'20148,872,225'Defect transferred and lattice mismatched epitaxial film'20148,846,480'Carrier mobility in surface-channel transistors, apparatus made therewith, and system containing same'20148,823,059'Non-planar semiconductor device having group III-V material active region with multi-dielectric gate stack'20148,803,255'Gate electrode having a capping layer'20148,785,907'Epitaxial film growth on patterned substrate'20148,785,909'Non-planar semiconductor device having channel region with low band-gap cladding layer'20148,765,563'Trench confined epitaxially grown device layer(s)'20148,748,269'Quantum-well-based semiconductor devices'20148,716,751'Methods of containing defects for non-silicon device engineering'20148,710,490'Semiconductor device having germanium active layer with underlying parasitic leakage barrier layer'20148,633,470'Techniques and configurations to impart strain to integrated circuit devices'20148,633,471'Apparatus and methods for forming a modulation doped non-planar transistor'20148,592,803'Germanium-based quantum well devices'20138,575,596'Non-planar germanium quantum well devices'20138,536,621'Quantum-well-based semiconductor devices'20138,501,508'Method of forming quantum well mosfet channels having uni-axial strains caused by metal source/drains'20138,440,998'Increasing carrier injection velocity for integrated circuit devices'20138,415,751'Method to reduce contact resistance of N-channel transistors by using a III-V semiconductor interlayer in source and drain'20138,390,082'Gate electrode having a capping layer'20138,384,128'Carrier mobility in surface-channel transistors, apparatus made therewith, and systems containing same'20138,378,334'Low power floating body memory cell based on low-bandgap-material quantum well'20138,350,291'Modulation-doped multi-gate devices'20138,344,425'Multi-gate III-V quantum well structures'20138,344,418'Materials for interfacing high-K dielectric layers with III-V semiconductors'20138,324,661'Quantum well transistors with remote counter doping'20128,283,653'Non-planar germanium quantum well devices'20128,278,687'Semiconductor heterostructures to reduce short channel effects'20128,258,543'Quantum-well-based semiconductor devices'20128,258,498'Quantum well MOSFET channels having uni-axial strain caused by metal source/drains, and conformal regrowth source/drains'20128,227,833'Dual layer gate dielectrics for non-silicon semiconductor devices'20128,193,523'Germanium-based quantum well devices'20128,148,772'Recessed channel array transistor (RCAT) structures'20128,129,749'Double quantum well structures for transistors'20128,120,063'Modulation-doped multi-gate devices'20128,115,235'Modulation-doped halo in quantum well field-effect transistors, apparatus made therewith, and methods of using same'20128,110,877'Metal-insulator-semiconductor tunneling contacts having an insulative layer disposed between source/drain contacts and source/drain regions'20128,030,197'Recessed channel array transistor (RCAT) in replacement metal gate (RMG) logic flow'20118,022,487'Increasing body dopant uniformity in multi-gate transistor devices'20118,021,940'Methods for fabricating PMOS metal gate structures'20118,017,933'Compositionally-graded quantum-well channels for semiconductor devices'20117,999,298'Embedded memory cell and method of manufacturing same'20117,999,351'Phase memorization for low leakage dielectric films'20117,968,457'Sandwiched metal structure silicidation for enhanced contact'20117,964,866'Low power floating body memory cell based on low bandgap material quantum well'20117,947,971'Quantum well MOSFET channels having uni-axial strain caused by metal source/drains, and conformal regrowth source/drains'20117,915,642'Apparatus and methods for forming a modulation doped non-planar transistor'20117,915,694'Gate electrode having a capping layer'20117,898,023'Recessed channel array transistor (RCAT) structures'20117,892,902'Group III-V devices with multiple spacer layers'20117,888,221'Tunneling field effect transistor using angled implants for forming asymmetric source/drain regions'20117,868,318'Quantum well field-effect transistors with composite spacer structures, apparatus made therewith, and methods of using same'20117,800,166'Recessed channel array transistor (RCAT) structures and method of formation'20107,759,142'Quantum well MOSFET channels having uni-axial strain caused by metal source/drains, and conformal regrowth source/drains'20107,736,956'Lateral undercut of metal gate in SOI device'20107,709,909'Method for making a semiconductor device having a high-k gate dielectric'20107,615,441'Forming high-k dielectric layers on smooth substrates'20097,531,404'Semiconductor device having a metal gate electrode formed on an annealed high-k gate dielectric layer'20097,524,727'Gate electrode having a capping layer'20097,465,976'Tunneling field effect transistor using angled implants for forming asymmetric source/drain regions'20087,442,983'Method for making a semiconductor device having a high-k gate dielectric'20087,402,875'Lateral undercut of metal gate in SOI device'20087,323,423'Forming high-k dielectric layers on smooth substrates'20087,084,038'Method for making a semiconductor device having a high-k gate dielectric'20067,074,680'Method for making a semiconductor device having a high-k gate dielectric'2006

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2006–2021Patents assigned to INTEL CORP (225)· patent assignee history
2006–2021Based in Hillsboro, OR, US· patent location history
2012–2019Patents assigned to DEWEY GILBERT (59)· patent assignee history
2012–2019Patents assigned to RADOSAVLJEVIC MARKO (49)· patent assignee history
2012–2019Patents assigned to PILLARISETTY RAVI (45)· patent assignee history
2012–2019Patents assigned to MUKHERJEE NILOY (35)· patent assignee history
2017–2021Based in Beaverton, OR, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
INTEL CORP2252006–2021
DEWEY GILBERTself592012–2019
RADOSAVLJEVIC MARKO492012–2019
PILLARISETTY RAVI452012–2019
MUKHERJEE NILOY352012–2019
Locations
LocationPatentsSpan
Hillsboro, OR, US1972006–2021
Beaverton, OR, US312017–2021