USPatentGranted
B2

Methods of containing defects for non-silicon device engineering

Granted 9 Jun 2015 · no office action yet

Life of the patent

3 dated events
⤢ drag to zoomApr 2014Jul 2014Oct 2014Jan 2015Apr 2015Jul 2015Prosecution
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Abstract

An apparatus including a device including a channel material having a first lattice structure on a well of a well material having a matched lattice structure in a buffer material having a second lattice structure that is different than the first lattice structure. A method including forming a trench in a buffer material; forming an n-type well material in the trench, the n-type well material having a lattice structure that is different than a lattice structure of the buffer material; and forming an n-type transistor. A system including a computer including a processor including complimentary metal oxide semiconductor circuitry including an n-type transistor including a channel material, the channel material having a first lattice structure on a well disposed in a buffer material having a second lattice structure that is different than the first lattice structure, the n-type transistor coupled to a p-type transistor.

Claims

15 · 3 independent · depth 3
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15 granted claims

Classifications

6 codes
IPC · International Patent Classification
Section H — Electricity
  • H01L21/02
  • H01L21/84
  • H01L29/78
  • H01L27/12
  • H01L27/092
  • H01L21/8238

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File wrapper

Pendency
1.1 y
407 days filing → grant
Office actions
0
none on record
Responses
1
no RCE
Examiner
David Vu
art unit 2818 · TC 2800
Citations: 16 back · 0 forward

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Priority chain

1 priority documents
›Priority documents — 1
TypeDocumentDate
related publicationUS 20140231871 A121 Aug 2014

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