Methods of containing defects for non-silicon device engineering
Granted 9 Jun 2015 · no office action yet
Current assignee: Tahoe Research, Ltd. · originally Intel Corporation
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Inventors: Niloy Mukherjee, Matthew V. Metz, Marko Radosavljevic, Willy Rachmady +8 · Examiner: David Vu · AU 2818 · TC 2800
Life of the patent
3 dated eventsAbstract
An apparatus including a device including a channel material having a first lattice structure on a well of a well material having a matched lattice structure in a buffer material having a second lattice structure that is different than the first lattice structure. A method including forming a trench in a buffer material; forming an n-type well material in the trench, the n-type well material having a lattice structure that is different than a lattice structure of the buffer material; and forming an n-type transistor. A system including a computer including a processor including complimentary metal oxide semiconductor circuitry including an n-type transistor including a channel material, the channel material having a first lattice structure on a well disposed in a buffer material having a second lattice structure that is different than the first lattice structure, the n-type transistor coupled to a p-type transistor.
Claims
15 · 3 independent · depth 3Classifications
6 codes- H01L21/02
- H01L21/84
- H01L29/78
- H01L27/12
- H01L27/092
- H01L21/8238
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1 priority documents›Priority documents — 1
| Type | Document | Date |
|---|---|---|
| related publication | US 20140231871 A1 | 21 Aug 2014 |
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