Electroplating flow shaping plate having offset spiral hole pattern
Granted 8 Nov 2011 · no office action yet
Current assignee: Novellus Systems, Inc. · originally Lam Research
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Attorney: Attorney · Log in to unlock
Inventors: Robert Rash, David Porter, Steven T. Mayer · Examiner: Selina Sikder · AU 2912 · TC 2900
Life of the patent
2 dated eventsDescription
1 parts›FIG. 1 is a front plan view of…
FIG. 1 is a front plan view of an electroplating flow shaping plate having offset spiral hole pattern showing an embodiment of our new design;
FIG. 2 is a bottom view thereof;
FIG. 3 is a right side elevational view thereof, the left, top and bottom side elevational views being identical images thereof;
FIG. 4 is a front perspective view thereof; and
FIG. 5 is a rear perspective view thereof.
FIG. 6 is a front plan view of an electroplating flow shaping plate having offset spiral hole pattern showing a second embodiment of our new design;
FIG. 7 is a bottom view thereof;
FIG. 8 is a right side elevational view thereof, the left, top and bottom side elevational views being identical images thereof;
FIG. 9 is a front perspective view thereof; and
FIG. 10 is a rear perspective view thereof.
FIG. 11 is a front plan view of an electroplating flow shaping plate having offset spiral hole pattern showing a third embodiment of our new design;
FIG. 12 is a bottom view thereof; and
FIG. 13 is a right side elevational view thereof, the left, top and bottom side elevational views being identical images thereof;
FIG. 14 is a front perspective view thereof; and
FIG. 15 is a rear perspective view thereof.
FIG. 16 is a front plan view of an electroplating flow shaping plate having offset spiral hole pattern showing a fourth embodiment of our new design;
FIG. 17 is a bottom view thereof; and
FIG. 18 is a right side elevational view thereof, the left, top and bottom side elevational views being identical images thereof;
FIG. 19 is a front perspective view thereof; and,
FIG. 20 is a rear perspective view thereof.
Claims
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2 members · 2 offices›IP5 & PCT — 1 members
| Office | Publication | Kind | Published | Filed | Status | Title |
|---|---|---|---|---|---|---|
| USthis patent | US-D648289-S | S1 | 8 Nov 2011 | 21 Oct 2010 | granted | Electroplating flow shaping plate having offset spiral hole pattern |
›Other offices — 1 members
| Office | Publication | Kind | Published | Filed | Status | Title |
|---|---|---|---|---|---|---|
| TW | TW-D148167-S | S | 11 Jul 2012 | 21 Apr 2011 | published | Electroplating flow shaping plate having offset spiral hole pattern |
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