Inventor
Robert Rash
Inventor
West Linn, OR, US
Overview
Patents· 43 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C25Dprimary
C25DProcesses for the electrolytic or electrophoretic production of coatings39%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
H01LSemiconductor devices17%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
B08BCleaning in general3%
C23GCleaning or de-greasing of metallic material by chemical methods other than electrolysis2%
G01FMeasuring volume, volume flow, mass flow or liquid level2%
G01NInvestigating or analysing materials by determining their chemical or physical properties2%
C25FProcesses for the electrolytic removal of materials from objects1%
F16KValves1%
PatentTitleYear
11,001,934Methods and apparatus for flow isolation and focusing during electroplating202110,982,346Integrated elastomeric lipseal and cup bottom for reducing wafer sticking202110,975,489One-piece anode for tuning electroplating at an edge of a substrate202110,969,036High flow multi-way piston valve for deposition systems202110,923,340Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity202110,920,335Electroplating apparatus for tailored uniformity profile202110,781,527Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating202010,760,178Method and apparatus for synchronized pressure regulation of separated anode chamber202010,662,545Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating202010,612,151Flow assisted dynamic seal for high-convection, continuous-rotation plating202010,301,738Methods and apparatus for wetting pretreatment for through resist metal plating201910,208,395Bubble and foam solutions using a completely immersed air-free feedback flow control valve201910,190,230Cross flow manifold for electroplating apparatus201910,092,933Methods and apparatuses for cleaning electroplating substrate holders201810,094,034Edge flow element for electroplating apparatus201810,087,545Automated cleaning of wafer plating assembly201810,066,311Multi-contact lipseals and associated electroplating methods201810,053,793Integrated elastomeric lipseal and cup bottom for reducing wafer sticking201810,017,869Electroplating apparatus for tailored uniformity profile201810,014,170Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity20189,988,733Apparatus and method for modulating azimuthal uniformity in electroplating20189,834,852Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating20179,828,688Methods and apparatus for wetting pretreatment for through resist metal plating20179,752,248'Methods and apparatuses for dynamically tunable wafer-edge electroplating'20179,721,800'Apparatus for wetting pretreatment for enhanced damascene metal filling'20179,624,592'Cross flow manifold for electroplating apparatus'20179,617,652'Bubble and foam solutions using a completely immersed air-free feedback flow control valve'20179,567,685'Apparatus and method for dynamic control of plated uniformity with the use of remote electric current'20179,523,155'Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating'20169,455,139'Methods and apparatus for wetting pretreatment for through resist metal plating'20169,394,620'Control of electrolyte hydrodynamics for efficient mass transfer during electroplating'20169,260,793'Electroplating apparatus for tailored uniformity profile'20169,221,081'Automated cleaning of wafer plating assembly'20159,139,927'Electrolyte loop with pressure regulation for separated anode chamber of electroplating system'20158,858,774'Electroplating apparatus for tailored uniformity profile'20148,603,305'Electrolyte loop with pressure regulation for separated anode chamber of electroplating system'20138,475,637'Electroplating apparatus with vented electrolyte manifold'20138,398,831'Rapidly cleanable electroplating cup seal'20138,377,268'Electroplating cup assembly'20138,172,992'Wafer electroplating apparatus for reducing edge defects'2012D0648289'Electroplating flow shaping plate having offset spiral hole pattern'20117,985,325'Closed contact electroplating cup assembly'20117,935,231'Rapidly cleanable electroplating cup assembly'2011Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2011–2021Patents assigned to NOVELLUS SYSTEMS INC (26)· patent assignee history
2011–2017Based in Portland, OR, US· patent location history
2012–2015Patents assigned to RASH ROBERT (7)· patent assignee history
2012–2015Patents assigned to MAYER STEVEN T (5)· patent assignee history
2012–2013Patents assigned to GANESAN KOUSIK (3)· patent assignee history
2016–2021Based in West Linn, OR, US· patent location history
2017–2021Patents assigned to LAM RES CORP (17)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NOVELLUS SYSTEMS INC | 26 | 2011–2021 |
| LAM RES CORP | 17 | 2017–2021 |
| RASH ROBERTself | 7 | 2012–2015 |
| MAYER STEVEN T | 5 | 2012–2015 |
| GANESAN KOUSIK | 3 | 2012–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| West Linn, OR, US | 26 | 2016–2021 |
| Portland, OR, US | 17 | 2011–2017 |