Inventor
Sadahito Misumi
Inventor
Ibaraki, JP
Overview
Patents· 31 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
Y10TTechnical subjects covered by former us classification15%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
C09JAdhesives10%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds7%
C08LCompositions of macromolecular compounds5%
H01LSemiconductor devices4%
Y02PClimate change mitigation technologies in the production or processing of goods4%
A01KAnimal husbandry3%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%
PatentTitleYear
9,153,556'Adhesive sheet for manufacturing semiconductor device, manufacturing method of semiconductor device using the sheet, and semiconductor device obtained by the method'20159,105,754'Adhesive film, method of manufacturing semiconductor device, and semiconductor device'20158,975,759'Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby'20158,890,190'Light-emitting diode element in which an optical semiconductor element is encapsulated by an encapsulating resin layer containing a light reflection component'20148,703,584'Dicing tape-integrated film for semiconductor back surface'20148,642,362'Method for producing light-emitting diode device'20148,592,260'Process for producing a semiconductor device'20138,580,617'Thermosetting die-bonding film'20138,304,341'Dicing die-bonding film'20128,278,153'Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby'20128,236,614'Semiconductor device manufacturing method'20128,143,106'Thermosetting die-bonding film'20127,998,552'Dicing/die bonding film'20117,863,182'Dicing die-bonding film'20117,780,811'Dicing die-bonding film, method of fixing chipped work and semiconductor device'20107,772,040'Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby'20107,611,926'Thermosetting die bonding film'2009D0589473'Adhesive film material for use in manufacturing semiconductors'20097,508,081'Dicing die-bonding film'20097,449,226'Dicing die-bonding film, method of fixing chipped work and semiconductor device'2008D0549189'Dicing die-bonding film'20077,232,709'Process for producing a semiconductor device'20076,896,994'Battery separator containing carbodiimide polymer'20056,811,927'Battery containing a polycarbodiimide polymer'20046,669,869'Anisotropic conductive film'20036,652,688'Process for producing semiconductor wafer with adhesive film'20036,492,484'Polycarbodiimide'20026,414,105'Aromatic polycarbodiimide and sheet thereof'20026,410,615'Semiconductor sealing epoxy resin composition and semiconductor device using the same'20026,248,857'Aromatic polycarbodiimide and polycarbodiimide sheet'20016,228,972'Aromatic polycarbodiimide and water repellent sheet made therefrom'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2015Patents assigned to NITTO DENKO CORP (31)· patent assignee history
2001–2015Based in Ibaraki, JP· patent location history
2001–2014Based in Osaka, JP· patent location history
2012–2015Patents assigned to MISUMI SADAHITO (11)· patent assignee history
2012–2015Patents assigned to MATSUMURA TAKESHI (8)· patent assignee history
2012–2015Patents assigned to HOSOKAWA KAZUHITO (3)· patent assignee history
2012–2015Patents assigned to KONDO HIROYUKI (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NITTO DENKO CORP | 31 | 2001–2015 |
| MISUMI SADAHITOself | 11 | 2012–2015 |
| MATSUMURA TAKESHI | 8 | 2012–2015 |
| HOSOKAWA KAZUHITO | 3 | 2012–2015 |
| KONDO HIROYUKI | 3 | 2012–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ibaraki, JP | 20 | 2001–2015 |
| Osaka, JP | 11 | 2001–2014 |