The infrared detector according to claim 7, wherein the infrared detection element comprises two sets of the first pyroelectric element for receiving infrared light and the second pyroelectric element for compensating temperature, one set thereof constituting a first detection element, another set thereof constituting a second detection element, and the first detection element and the second detection element being on the single pyroelectric substrate,nthe optical filter comprises:na first optical filter disposed in front of a light receiving surface of the first pyroelectric element of the first detection element; anda second optical filter disposed in front of a light receiving surface of the first pyroelectric element of the second detection element,the first detection element and the second detection element respectively comprise first output terminals provided on the surface of the single pyroelectric substrate, the first detection element and the second detection element further respectively comprising second output terminals provided on the back face of the single pyroelectric substrate,the first output terminals are disposed so as not to overlap with the second output terminals in a thickness direction of the single pyroelectric substrate,the base body comprises:nan insulation base member having an electric insulation property;two first lead terminals; andtwo second lead terminals, the two first lead terminals and the two first lead terminals being provided integrally with the insulation base member,the first lead terminals are respectively electrically connected with the first output terminals of the first detection element and the second detection element individually via first bonding portions, each of which is made of a conductive adhesive,the second lead terminals are respectively electrically connected with the second output terminals of the first detection element and the second detection element individually via second bonding portions, each of which is made of a conductive adhesive,the insulation base member is provided on a first surface thereof with at least one of:na projection for positioning the infrared detection element, the projection projecting between each of the first lead terminals and a corresponding second lead terminal, outside an area where the infrared detection element is to be mounted, in a thickness direction of the insulation base member; anda wall for positioning the infrared detection element, the wall projecting, outside the area where the infrared detection element is to be mounted, in the thickness direction of the insulation base member, a height of the wall being smaller than a thickness of the infrared detection element.
›9.↳ 8The infrared detector according to claim 8, wherein the insulation base member is provided with a positioning portion for positioning the first optica…d4+1
The infrared detector according to claim 8, wherein the insulation base member is provided with a positioning portion for positioning the first optical filter and the second optical filter, andnthe positioning portion projects from the first surface of the insulation base member in a direction along a thickness direction of the infrared detection element.
›10.↳ 9The infrared detector according to claim 9, wherein the positioning portion comprises:na wall portion for defining positions of the first optical filt…d5
The infrared detector according to claim 9, wherein the positioning portion comprises:na wall portion for defining positions of the first optical filter and the second optical filter in a direction in which the first optical filter and the second optical filter are arranged in planar view; andsupporting portions between which the first optical filter and the second optical filter are installed.
›11.↳ 8The infrared detector according to claim 8, further comprising:na first IC element for signal processing a first output signal of the first detection …d4
The infrared detector according to claim 8, further comprising:na first IC element for signal processing a first output signal of the first detection element; anda second IC element for signal processing a second output signal of the second detection element,the infrared detection element being disposed on a first surface side of the base body, andthe first IC element and the second IC element being disposed on a second surface side of the base body.
›16.↳ 8An infrared type gas sensor comprising:nthe infrared detector according to claim 8;an infrared emitting element configured to emit infrared by thermal…d4+1
An infrared type gas sensor comprising:nthe infrared detector according to claim 8;an infrared emitting element configured to emit infrared by thermal radiation;a sample cell disposed between the infrared emitting, element and the infrared detector; anda signal processor,wherein the first optical filter has a first transmission wavelength band for transmitting infrared having an absorption wavelength of gas as a detection object,the second optical filter has a second transmission wavelength band, without overlapping with the first transmission wavelength band, for transmitting infrared having a reference wavelength as a non-absorption wavelength of the gas,the sample cell is provided with a vent hole through which the gas as the detection object is introduced therein or discharged outside, andthe signal processor is configured to calculate concentration of the gas based on a difference or a ratio between a first output signal of the first detection element and a second output signal of the second detection element.
›17.↳ 16The infrared type gas sensor according to claim 16, wherein the sample cell is shaped like a tube, an inner face of which is configured as a reflectio…d5
The infrared type gas sensor according to claim 16, wherein the sample cell is shaped like a tube, an inner face of which is configured as a reflection surface for reflecting infrared emitted from the infrared emitting element,nthe reflection surface is in a shape of a spheroid, a rotation axis of which is a major axis defined as a central axis of the sample cell, both ends of the spheroid in a direction of the major axis being cut by two planes perpendicular to the major axis,the infrared emitting element is disposed in vicinity of one focal point of the spheroid on the central axis, andthe infrared detector is disposed at a position near another focal point of the spheroid between the infrared emitting element and the another focal point on the central axis.