A system and method for packaging semiconductor dies is provided. An embodiment comprises a first package with a first contact and a second contact. A post-contact material is formed on the first contact in order to adjust the height of a joint between the contact pad a conductive bump. In another embodiment a conductive pillar is utilized to control the height of the joint between the contact pad and external connections.

Claims

20 · 3 independent · depth 3

20 granted claims

›1.independentA semiconductor device comprising:na first package with a first side;a first contact located on the first side and a second contact located on the fir…+4

›6.independentA semiconductor device comprising:na first contact and a second contact on a first side of a first package; anda conductive pillar extending away from…+7

›14.independentA semiconductor device comprising:na first package;a first contact and a second contact within the first package, wherein the first contact and the se…+6

Classifications

2 codes

IPC · International Patent Classification

Section H — Electricity

H01L23/02

USPC · US Patent Classification

257/686

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Pendency

2.8 y

1,015 days filing → grant

Office actions

after a restriction

Responses

2 RCE

Examiner

Hoa B Trinh

art unit 2893 · TC 2800

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Citations: 1 back · 0 forward

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Priority chain

1 priority documents

›Priority documents — 1

Type	Document	Date
related publication	US 20130187268 A1	25 Jul 2013

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