LexDanaLexDanabeta
Inventor

Wei-Hung Lin

Inventor
Xinfeng Township, TW

Overview

168→
Patents
2008–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 168 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices22%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
G11CStatic stores13%
G06FElectric digital data processing9%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
H05KPrinted circuits4%
B23KSoldering or unsoldering3%
H01RElectrically-conductive connections3%
H03MCoding2%
Y10TTechnical subjects covered by former us classification2%
PatentTitleYear
11,123,319Methods and compositions for treating edema refractory to oral diuretics202111,094,556Method of manufacturing semiconductor devices using directional process202111,081,354Fin patterning methods for increased process margins202111,075,079Directional deposition for semiconductor fabrication202110,872,667Decoding method, memory controlling circuit unit and memory storage device202010,867,932Method for manufacturing package structure202010,857,428Luminous ball with remote activation capability202010,832,999Packaging methods for semiconductor devices comprising forming trenches in separation regions between adjacent packaging substrates202010,797,025Advanced INFO POP and method of forming thereof202010,776,053Memory control method, memory storage device and memory control circuit unit202010,734,263Semiconductor processing boat design with pressure sensor202010,707,084Method of manufacturing wafer level chip scale package202010,685,711Decoding method, memory controlling circuit unit and memory storage device202010,679,707Voltage adjusting method, memory controlling circuit unit and memory storage device202010,629,508Packaged semiconductor devices and methods of packaging semiconductor devices202010,628,259Bit determining method, memory control circuit unit and memory storage device202010,622,077Decoding method, memory storage device and memory control circuit unit202010,600,709Bump-on-trace packaging structure and method for forming the same202010,586,596Data writing method, memory control circuit unit and memory storage apparatus202010,559,546Package on package structure and method for forming the same202010,535,609Package structure and method for forming the same202010,535,616Warpage control in package-on-package structures202010,522,452Packaging methods for semiconductor devices including forming trenches in workpiece to separate adjacent packaging substrates201910,522,234Bit tagging method, memory control circuit unit and memory storage device201910,510,716Packaged semiconductor devices and methods of packaging semiconductor devices201910,510,630Molding structure for wafer level package201910,475,679Semiconductor processing boat design with pressure sensor201910,445,002Data accessing method, memory controlling circuit unit and memory storage device201910,424,391Decoding method, memory controlling circuit unit and memory storage device201910,409,674Decoding method, memory control circuit unit and memory storage apparatus201910,373,931Semiconductor package structure and method of manufacturing the same201910,373,941Package-on-package structures and methods for forming the same201910,310,941Data encoding method, memory control circuit unit and memory storage device201910,283,427Molding structure for wafer level package201910,269,673Packaged semiconductor devices and methods of packaging semiconductor devices201910,269,763Package-on-package structure having polymer-based material for warpage control201910,192,804Bump-on-trace packaging structure and method for forming the same201910,177,104Package on package structure and method for forming the same201910,170,434Warpage control in package-on-package structures201910,159,874Luminous ball201810,163,804Molding structure for wafer level package201810,153,180Semiconductor bonding structures and methods201810,141,281Substrate and package structure201810,134,717Semiconductor package, semiconductor device and method of forming the same201810,134,703Package on-package process for applying molding compound201810,074,433Data encoding method, memory control circuit unit and memory storage device201810,067,824Error processing method, memory storage device and memory controlling circuit unit201810,049,894Package structures and methods for forming the same201810,025,660Data reading method, memory control circuit unit and memory storage apparatus201810,014,260Package structure and method for forming the same20189,972,390Two pass memory programming method, memory control circuit unit and memory storage apparatus20189,947,417Memory management method, memory storage device and memory controlling circuit unit20189,941,221Warpage control in package-on-package structures20189,935,091Package-on-package structures and methods for forming the same20189,911,633'Semiconductor processing boat design with pressure sensor'20189,911,674'Molding structure for wafer level package'20189,911,675'Packaged semiconductor devices and methods of packaging semiconductor devices'20189,891,991'Decoding method, memory storage device and memory control circuit unit'20189,892,799'Read voltage tracking method, memory storage device and memory control circuit unit'20189,887,162'Molding structure for wafer level package'20189,871,018'Packaged semiconductor devices and methods of packaging semiconductor devices'20189,865,574'Alignment in the packaging of integrated circuits'20189,859,229'Package structure and method for forming the same'20189,837,278Wafer level chip scale package and method of manufacturing the same20179,837,435Three-dimensional non-volatile memory structure and manufacturing method thereof20179,821,196'Luminous ball'20179,812,194'Decoding method, memory storage device and memory control circuit unit'20179,799,631'Semiconductor packaging structure and method'20179,776,048'Light releasing sphere structure'20179,761,551'Solder joint structure for ball grid array in wafer level package'20179,715,429'Decoding method, memory storage device and memory control circuit unit'20179,711,470'Package on package structure and method for forming the same'20179,703,698'Data writing method, memory controller and memory storage apparatus'20179,673,182'Package on package bonding structure and method for forming the same'20179,639,419'Read voltage level estimating method, memory storage device and memory control circuit unit'20179,627,355'Package-on-package structure having polymer-based material for warpage control'20179,612,630'Flash drive'20179,607,704'Data reading method, memory controlling circuit unit and memory storage device'20179,582,224'Memory control circuit unit, memory storage apparatus and data accessing method'20179,583,217'Decoding method, memory storage device and memory control circuit unit'20179,583,464'Semiconductor packaging structure and method'2017D0779438'Electrical connector'20179,563,508'Memory management method, memory control circuit unit and memory storage apparatus'20179,559,064'Warpage control in package-on-package structures'20179,559,005'Methods of packaging and dicing semiconductor devices and structures thereof'20179,543,185'Packaging process tools and systems, and packaging methods for semiconductor devices'20179,536,818'Semiconductor package and method of forming the same'20179,530,762'Semiconductor package, semiconductor device and method of forming the same'20169,530,509'Data programming method, memory storage device and memory control circuit unit'20169,529,666'Decoding method, memory storage device and memory controlling circuit unit'20169,526,186'Storage device and producing method of the same'20169,518,728'Sphere structure'20169,514,819'Programming method, memory storage device and memory controlling circuit unit'20169,496,041'Memory programming method, memory control circuit unit and memory storage device'20169,465,584'Method for generating random number, memory storage device and control circuit'20169,460,043'Flash drive with transforming mechanism'20169,449,934'Solder joint structure for ball grid array in wafer level package'20169,437,309'Operating method of NAND flash memory unit'20169,431,360'Semiconductor structure and manufacturing method thereof'20169,427,818'Semiconductor processing boat design with pressure sensor'20169,425,157'Substrate and package structure'20169,425,569'Storage device'20169,412,689'Semiconductor packaging structure and method'20169,412,723'Package on-package structures and methods for forming the same'20169,401,337'Molding structure for wafer level package'20169,396,804'Memory programming method, memory control circuit unit and memory storage apparatus'20169,397,062'Package on package bonding structure and method for forming the same'20169,385,040'Method of manufacturing a semiconductor device'20169,362,236'Package structures and methods for forming the same'20169,361,024'Memory cell programming method, memory control circuit unit and memory storage apparatus'20169,349,475'Time estimating method, memory storage device, and memory controlling circuit unit'20169,349,663'Package-on-package structure having polymer-based material for warpage control'20169,343,386'Alignment in the packaging of integrated circuits'20169,331,023'Device packaging'20169,312,013'Configuration method of erase operation, memory controlling circuit unit and memory storage device'20169,299,688'Packaged semiconductor devices and methods of packaging semiconductor devices'20169,286,986'Data writing method, and memory control circuit unit and memory storage apparatus using the same'20169,281,631'Connector and storage device using the same'20169,274,891'Decoding method, memory storage device, and memory controlling circuit unit'20169,268,634'Decoding method, memory storage device and memory controlling circuit unit'20169,269,687'Packaging methods and packaged semiconductor devices'20169,263,412'Packaging methods and packaged semiconductor devices'20169,257,187'Data storing method, memory control circuit unit and memory storage apparatus'20169,257,204'Read voltage setting method, and control circuit, and memory storage apparatus using the same'20169,257,777'Flash drive'20169,252,135'Packaged semiconductor devices and methods of packaging semiconductor devices'20169,245,636'NAND flash memory unit, operating method and reading method'20169,219,030'Package on package structures and methods for forming the same'20159,218,999'Packaging process tools and packaging methods for semiconductor devices'20159,192,063'Flash drive and operating method thereof'20159,136,875'Decoding method, memory storage device and rewritable non-volatile memory module'20159,136,661'Storage device'20159,122,421'Connecting part of storage device'20159,123,418'NAND flash memory unit and NAND flash memory array'20159,082,636'Packaging methods and structures for semiconductor devices'20159,073,158'Methods for forming 3DIC package'20159,059,148'Contact structure'20159,019,770'Data reading method, and control circuit, memory module and memory storage apparatus and memory module using the same'20159,007,829'Memory repairing method, and memory controller and memory storage apparatus using the same'20159,001,585'Data writing method, memory control circuit unit and memory storage apparatus'20158,979,596'Storage interface module'20158,976,533'Storage device and method for producing the same'20158,972,653'Memory management method, and memory controller and memory storage apparatus using the same'20158,927,391'Package-on-package process for applying molding compound'20158,928,134'Package on package bonding structure and method for forming the same'20158,884,431'Packaging methods and structures for semiconductor devices'20148,878,352'Semiconductor packaging structure and method'20148,846,448'Warpage control in a package-on-package structure'20148,830,750'Data reading method, and control circuit, memory module and memory storage apparatus using the same'20148,809,117'Packaging process tools and packaging methods for semiconductor devices'20148,755,227'NAND flash memory unit, NAND flash memory array, and methods for operating them'20148,737,126'Data writing method, and memory controller and memory storage apparatus using the same'20148,616,433'Forming low stress joints using thermal compress bonding'20138,609,462'Methods for forming 3DIC package'20138,603,860'Process for forming packages'20138,586,408'Contact and method of formation'20138,556,158'Thermal compress bonding'20138,476,110'Method of manufacturing storage apparatus'20138,393,907'Storage apparatus and method of manufacturing the same'20138,381,965'Thermal compress bonding'20138,360,303'Forming low stress joints using thermal compress bonding'20138,254,132'Flash drive and housing assembly thereof'20128,120,903'Storage apparatus'20127,875,805'Warpage-proof circuit board structure'20117,754,598'Method for manufacturing coreless packaging substrate'20107,740,494'Data storage apparatus'20107,672,122'Flash memory disk with rotatable and telescopic protection structure and method using the same'20107,351,067'Coaxial cable connecting apparatus'2008

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2010–2020Patents assigned to PHISON ELECTRONICS CORP (71)· patent assignee history
2010–2021Based in Hsinchu, TW· patent location history
2012–2017Patents assigned to LIN WEI-HUNG (20)· patent assignee history
2012–2020Based in Hsinchu County, TW· patent location history
2013–2016Patents assigned to TAIWAN SEMICONDUCTOR MFG (24)· patent assignee history
2013–2017Patents assigned to LIU CHUNG-SHI (14)· patent assignee history
2013–2020Based in Xinfeng Township, TW· patent location history
2014–2020Based in Taipei, TW· patent location history
2015–2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (62)· patent assignee history
2016–2020Based in New Taipei, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
PHISON ELECTRONICS CORP712010–2020
TAIWAN SEMICONDUCTOR MFG CO LTD622015–2021
TAIWAN SEMICONDUCTOR MFG242013–2016
LIN WEI-HUNGself202012–2017
LIU CHUNG-SHI142013–2017
Locations
LocationPatentsSpan
Xinfeng Township, TW642013–2020
Taipei, TW532014–2020
Hsinchu County, TW282012–2020
Hsinchu, TW112010–2021
New Taipei, TW52016–2020