Device including two semiconductor chips and manufacturing thereof

A device, comprising:na first semiconductor chip comprising a first contact pad on a first face;a second semiconductor chip comprising a first contact pad on a first face, wherein the second semiconductor chip is placed over the first semiconductor chip, the first face of the first semiconductor chip faces the first face of the second semiconductor chip, and the first contact pad on the first face of the first semiconductor chip is directly opposite the first contact pad on the first face of the second semiconductor chip; andexactly one layer of an electrically conductive material arranged between the first semiconductor chip and the second semiconductor chip, whereinnthe exactly one layer of an electrically conductive material electrically couples the first contact pad of the first semiconductor chip to the first contact pad of the second semiconductor chip,a contour of the first contact pad of the first semiconductor chip defines a first section of the first face of the first semiconductor chip, andthe first section of the first semiconductor chip and the exactly one layer of an electrically conductive material each have a smaller area than then an area of the first face of the first semiconductor chip.

A method of forming a device, the method comprising:nproviding a first semiconductor chip comprising a first contact pad on a first face;providing a second semiconductor chip comprising a first contact pad on a first face; andforming exactly one layer of an electrically conductive material between the first semiconductor chip and the second semiconductor chip, whereinnthe second semiconductor chip is placed over the first semiconductor chip and the first face of the first semiconductor chip faces the first face of the second semiconductor chip,the first contact pad on the first face of the first semiconductor chip is directly opposite the first contact pad on the first face of the second semiconductor chip,the exactly one layer of the electrically conductive material electrically couples the first contact pad of the first semiconductor chip to the first contact pad of the second semiconductor chip,a contour of the first contact pad of the first semiconductor chip defines a first section of the first face of the first semiconductor chip,the first section of the first semiconductor chip and the exactly one layer of an electrically conductive material each have a smaller area than then an area of the first face of the first semiconductor chip, andthe second semiconductor chip is placed within the first section.