Inventor
Henrik Ewe
Inventor
Burglengenfeld, DE
Overview
Patents· 21 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1049%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
H01LSemiconductor devices17%
H05KPrinted circuits7%
Y10TTechnical subjects covered by former us classification5%
H10HInorganic light-emitting semiconductor devices having potential barriers2%
PatentTitleYear
10,020,245Laminate electronic device20189,437,548'Chip package and method for manufacturing the same'20169,142,739'Method and system for providing a reliable light emitting diode semiconductor device'20159,123,687'Method of manufacturing a semiconductor device'20159,059,155'Chip package and method for manufacturing the same'20159,059,083'Semiconductor device'20158,952,545'Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof'20158,866,302'Device including two semiconductor chips and manufacturing thereof'20148,816,504'Device including two semiconductor chips and manufacturing thereof'20148,664,043'Method of manufacturing a laminate electronic device including separating a carrier into a plurality of parts'20148,507,320'Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof'20138,201,326'Method of manufacturing a semiconductor device'20128,120,158'Laminate electronic device'20128,097,936'Component, power component, apparatus, method of manufacturing a component, and method of manufacturing a power semiconductor component'20127,955,901'Method for producing a power semiconductor module comprising surface-mountable flat external contacts'20117,838,978'Semiconductor device'20107,821,128'Power semiconductor device having lines within a housing'20107,799,601'Electronic device and method of manufacturing same'20107,662,726'Integrated circuit device having a gas-phase deposited insulation layer'20107,524,775'Method for producing a dielectric layer for an electronic component'20097,479,691'Power semiconductor module having surface-mountable flat external contacts and method for producing the same'2009Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2009–2018Patents assigned to INFINEON TECHNOLOGIES AG (18)· patent assignee history
2009–2018Based in Burglengenfeld, DE· patent location history
2012–2015Patents assigned to EWE HENRIK (8)· patent assignee history
2012–2015Patents assigned to MAHLER JOACHIM (7)· patent assignee history
2012–2015Patents assigned to PRUECKL ANTON (5)· patent assignee history
2014Patents assigned to LANDAU STEFAN (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 18 | 2009–2018 |
| EWE HENRIKself | 8 | 2012–2015 |
| MAHLER JOACHIM | 7 | 2012–2015 |
| PRUECKL ANTON | 5 | 2012–2015 |
| LANDAU STEFAN | 2 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Burglengenfeld, DE | 21 | 2009–2018 |