Inventor
Anton Prueckl
Inventor
Schierling, DE
Overview
Patents· 20 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1046%
H01LSemiconductor devices22%
H05KPrinted circuits10%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
Y10TTechnical subjects covered by former us classification5%
H01CResistors2%
H10DInorganic electric semiconductor devices2%
H10NElectric solid-state devices not otherwise provided for2%
PatentTitleYear
10,020,245Laminate electronic device20189,607,966'Chip arrangement'20179,576,944'Semiconductor devices with transistor cells and thermoresistive element'20179,443,760'Multichip power semiconductor device'20169,437,548'Chip package and method for manufacturing the same'20169,123,687'Method of manufacturing a semiconductor device'20159,059,155'Chip package and method for manufacturing the same'20159,018,773'Chip arrangement and a method for forming a chip arrangement'20158,916,968'Multichip power semiconductor device'20148,866,302'Device including two semiconductor chips and manufacturing thereof'20148,866,274'Semiconductor packages and methods of formation thereof'20148,847,385'Chip arrangement, a method for forming a chip arrangement, a chip package, a method for forming a chip package'20148,816,504'Device including two semiconductor chips and manufacturing thereof'20148,698,298'Laminate electronic device'20148,686,569'Die arrangement and method of forming a die arrangement'20148,664,043'Method of manufacturing a laminate electronic device including separating a carrier into a plurality of parts'20148,648,473'Chip arrangement and a method for forming a chip arrangement'20148,598,694'Chip-package having a cavity and a manufacturing method thereof'20138,201,326'Method of manufacturing a semiconductor device'20128,120,158'Laminate electronic device'2012Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2012–2018Patents assigned to INFINEON TECHNOLOGIES AG (17)· patent assignee history
2012–2015Patents assigned to PRUECKL ANTON (12)· patent assignee history
2012–2015Patents assigned to MAHLER JOACHIM (11)· patent assignee history
2012–2015Patents assigned to EWE HENRIK (5)· patent assignee history
2012–2018Based in Schierling, DE· patent location history
2014Patents assigned to LANDAU STEFAN (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 17 | 2012–2018 |
| PRUECKL ANTONself | 12 | 2012–2015 |
| MAHLER JOACHIM | 11 | 2012–2015 |
| EWE HENRIK | 5 | 2012–2015 |
| LANDAU STEFAN | 3 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Schierling, DE | 20 | 2012–2018 |