A system and method for conductive pillars is provided. An embodiment comprises a conductive pillar having trenches located around its outer edge. The trenches are used to channel conductive material such as solder when a conductive bump is formed onto the conductive pillar. The conductive pillar may then be electrically connected to another contact through the conductive material.

Claims

20 · 3 independent · depth 3

20 granted claims

›1.independentA semiconductor device comprising:na first substrate; anda conductive post extending away from the first substrate, the conductive post comprising one…+7

›9.independentA semiconductor device comprising:na first substrate;a conductive post extending away from the substrate, the conductive post having a first longitudi…+5

›15.independentA semiconductor device comprising:na conductive post extending away from a substrate;one or more trenches extending from a first end of the conductive…+5

Classifications

4 codes

IPC · International Patent Classification

Section H — Electricity

H01L23/485
H01L21/768

USPC · US Patent Classification

257/737438/613

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Pendency

3.1 y

1,131 days filing → grant

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Responses

2 RCE

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Examiner

Walter H Swanson

art unit 2823 · TC 2800

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Citations: 15 back · 0 forward

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Priority chain

1 priority documents

›Priority documents — 1

Type	Document	Date
related publication	US 20130020698 A1	24 Jan 2013

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