USPatentGranted
B1

Multiple via connections using connectivity rings

Granted 17 Jun 2014 · 2 office actions

Application
13/751,264
filed 28 Jan 2013
Publication
Not published
not published
Patent· this page
US 8,756,552
granted 17 Jun 2014

Life of the patent

6 dated events
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Abstract

Among other things, one or more techniques and/or systems for performing design layout are provided. In an example, a design layout corresponds to a layout of a standard cell whose connectivity is described by a netlist. For example, the netlist specifies net types for respective vias of the standard cell. One or more connectivity rings are formed within the design layout to provide connectivity for one or more vias of the design layout. For example, a first connectivity ring is generated, such as from mandrel, to connect one or more ring one vias. A second connectivity ring is generated, such as from passive pattern, to connect one or more ring two vias. One or more cuts are generated within the design layout to isolate vias having different net types. In this way, the design layout is self-aligned double patterning (SADP) compliant.

Claims

20 · 3 independent · depth 4
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20 granted claims

Classifications

5 codes
IPC · International Patent Classification
Section G — Physics
  • G06F17/50
USPC · US Patent Classification
716/127716/126716/120716/133

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File wrapper

⤢ drag to zoomJan 2013Apr 2013Jul 2013Oct 2013Jan 2014Apr 2014Jul 2014USPTOApplicantNon-final rejectionResponse after non-final
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Pendency
1.4 y
505 days filing → grant
Office actions
1
non-final + final
Responses
1
no RCE
Examiner
Naum Levin
art unit 2851 · TC 2800
Citations: 15 back · 0 forward

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