Multiple via connections using connectivity rings
Granted 17 Jun 2014 · 2 office actions
Assignee: Taiwan Semiconductor Manufacturing Company
Law firm: Law firm · Log in to unlock
Attorney: Attorney · Log in to unlock
Inventors: Chin-Hsiung Hsu, Lee-Chung Lu, Hui-Zhong Zhuang, Cheng-I Huang +4 · Examiner: Naum Levin · AU 2851 · TC 2800
Life of the patent
6 dated eventsAbstract
Among other things, one or more techniques and/or systems for performing design layout are provided. In an example, a design layout corresponds to a layout of a standard cell whose connectivity is described by a netlist. For example, the netlist specifies net types for respective vias of the standard cell. One or more connectivity rings are formed within the design layout to provide connectivity for one or more vias of the design layout. For example, a first connectivity ring is generated, such as from mandrel, to connect one or more ring one vias. A second connectivity ring is generated, such as from passive pattern, to connect one or more ring two vias. One or more cuts are generated within the design layout to isolate vias having different net types. In this way, the design layout is self-aligned double patterning (SADP) compliant.
Claims
20 · 3 independent · depth 4Classifications
5 codes- G06F17/50
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