Interposer and semiconductor device

An interposer to be provided together with a semiconductor chip in a semiconductor device and, when the semiconductor device is mounted on a mount board, disposed between the semiconductor chip and the mount board, the interposer comprising:nan insulative substrate of an insulative resin;an island provided on one surface of the insulative substrate to be bonded to a rear surface of the semiconductor chip via a bonding agent;a thermal pad provided on the other surface of the insulative substrate opposite from the one surface in generally opposed relation to the island with the intervention of the insulative substrate;thermal vias extending through the insulative substrate from the one surface to the other surface to connect the island to the thermal pad in a thermally conductive manner;metal terminals formed on the other surface of the insulative substrate; andconnection vias, being different from thermal vias, extending through the insulative substrate from the one surface to the other surface to be connected to the metal terminals respectively,wherein the thermal vias include a first thermal via having a relatively-large diameter and a second thermal via having a relatively-small diameter, andeach of the connection vias has a diameter that is smaller than the diameter of the first thermal via and larger than the diameter of the second thermal via.

An interposer comprising:nan insulative substrate having via-holes arranged in a matrix array with an electrically conductive island provided on a front surface thereof;wherein the insulative substrate has heat dissipation via-holes provided in addition to the via-holes arranged in the matrix array in a region thereof opposed to the island,the heat dissipation via-holes include a first heat dissipation via-hole having a relatively-large diameter and a second heat dissipation via-hole having a relatively-small diameter, andeach of the connection via-holes has a diameter that is smaller than the diameter of the first heat dissipation via-hole and larger than the diameter of the second heat dissipation via-hole.

A semiconductor device comprising:na semiconductor chip;an insulative substrate of an insulative resin;an island provided on one surface of the insulative substrate and bonded to a rear surface of the semiconductor chip via a bonding agent;a thermal pad provided on the other surface of the insulative substrate opposite from the one surface in generally opposed relation to the island with the intervention of the insulative substrate;thermal vias extending through the insulative substrate from the one surface to the other surface to connect the island to the thermal pad in a thermally conductive manner;metal terminals formed on the other surface of the insulative substrate; andconnection vias, being different from thermal vias, extending through the insulative substrate from the one surface to the other surface to be connected to the metal terminals respectively,wherein the thermal vias include a first thermal via having a relatively-large diameter and a second thermal via having a relatively-small diameter, andeach of the connection vias has a diameter that is smaller than the diameter of the first thermal via and larger than the diameter of the second thermal via.

A semiconductor device comprising:nan insulative substrate having via-holes arranged in a matrix array with an electrically conductive island provided on a front surface thereof; anda semiconductor chip die-bonded to the island via an electrically conductive layer;wherein the insulative substrate has heat dissipation via-holes provided in addition to the via-holes arranged in the matrix array in a region thereof opposed to the island,the heat dissipation via-holes include a first heat dissipation via-hole having a relatively-large diameter and a second heat dissipation via-hole having a relatively-small diameter, andeach of the connection via-holes has a diameter that is smaller than the diameter of the first heat dissipation via-hole and larger than the diameter of the second heat dissipation via-hole.