Inventor

Motoharu Haga

Inventor

Kyoto, JP

Overview

2009–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 40 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1042%

H01LSemiconductor devices32%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%

B23KSoldering or unsoldering4%

H10DInorganic electric semiconductor devices3%

G01RMeasuring electric variables2%

H03KPulse technique2%

H05KPrinted circuits2%

Y02PClimate change mitigation technologies in the production or processing of goods1%

PatentTitleYear

11,094,601Semiconductor element and method for producing the same2021 11,063,127Semiconductor element and semiconductor device provided with the same2021 10,903,129Electronic device2021 10,707,154Semiconductor device and method for manufacturing the same2020 10,629,520Semiconductor device and method for manufacturing the same2020 10,566,305Semiconductor device with protection layer surrounding a bonding pad2020 10,340,208Semiconductor device2019 10,332,815Electronic device2019 10,269,754Semiconductor device2019 10,177,134Semiconductor device2019 10,163,850Semiconductor device2018 10,109,560Wire bonding structure and electronic device2018 10,090,229Semiconductor device and method for manufacturing the same2018 10,068,871Semiconductor device and method for manufacturing the same2018 9,991,213Resin-encapsulated semiconductor device and its manufacturing method2018 9,941,266Semiconductor device2018 9,941,237Semiconductor device and method for making semiconductor device2018 9,899,300'Semiconductor device'2018 9,847,280Method for manufacturing semiconductor device2017 9,780,069'Semiconductor device'2017 9,698,068'Electronic device'2017 9,666,501'Semiconductor device including a lead frame'2017 9,640,455'Semiconductor device'2017 9,601,455'Semiconductor device and method for making semiconductor device'2017 9,520,374'Semiconductor device, substrate and semiconductor device manufacturing method'2016 9,502,339'Resin-encapsulated semiconductor device and its manufacturing method'2016 9,355,988'Semiconductor device'2016 9,331,008'Semiconductor device'2016 9,287,202'Resin-encapsulated semiconductor device and its manufacturing method'2016 8,829,660'Resin-encapsulated semiconductor device'2014 8,810,016'Semiconductor device, substrate and semiconductor device manufacturing method'2014 8,368,234'Semiconductor device, production method for the same, and substrate'2013 8,350,371'Semiconductor device and method of manufacturing semiconductor device'2013 8,115,299'Semiconductor device, lead frame and method of manufacturing semiconductor device'2012 8,039,934'Resin-encapsulated semiconductor device and its manufacturing method'2011 8,022,532'Interposer and semiconductor device'2011 7,923,834'Interposer and semiconductor device'2011 7,902,681'Semiconductor device, production method for the same, and substrate'2011 7,825,498'Semiconductor device'2010 7,608,930'Semiconductor device and method of manufacturing semiconductor device'2009

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2009–2021Patents assigned to ROHM CO LTD (39)· patent assignee history

2009–2021Based in Kyoto, JP· patent location history

2012–2017Patents assigned to HAGA MOTOHARU (6)· patent assignee history

2012–2014Patents assigned to KASUYA YASUMASA (5)· patent assignee history

2012–2014Patents assigned to YASUNAGA SHOJI (3)· patent assignee history

2013–2014Patents assigned to MATSUBARA HIROAKI (2)· patent assignee history

2021Based in Kyoto-shi, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
ROHM CO LTD	39	2009–2021
HAGA MOTOHARUself	6	2012–2017
KASUYA YASUMASA	5	2012–2014
YASUNAGA SHOJI	3	2012–2014
MATSUBARA HIROAKI	2	2013–2014

Locations

Location	Patents	Span
Kyoto, JP	39	2009–2021
Kyoto-shi, JP	1	2021