Inventor

Yasumasa Kasuya

Inventor

Kyoto, JP

Overview

2003–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 34 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1046%

H01LSemiconductor devices26%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%

B23KSoldering or unsoldering6%

B05BSpraying apparatus4%

H02PControl or regulation of electric motors, electric generators or dynamo-electric converters3%

H05KPrinted circuits3%

H10DInorganic electric semiconductor devices3%

LOC131%

Y02PClimate change mitigation technologies in the production or processing of goods1%

PatentTitleYear

10,832,996Power module and motor drive circuit2020 10,790,258Electronic device and mounting structure of the same2020 10,679,928Power module and motor drive circuit2020 10,497,644Semiconductor device with first and second semiconductor chips connected to insulating element2019 10,366,948Semiconductor device and method for manufacturing the same2019 10,192,845Electronic device and mounting structure of the same2019 10,163,850Semiconductor device2018 10,056,318Support terminal integral with die pad in semiconductor package2018 D0824866Semiconductor device2018 9,991,213Resin-encapsulated semiconductor device and its manufacturing method2018 9,941,233Electronic device and mounting structure of the same2018 9,899,300'Semiconductor device'2018 9,831,161Support terminal integral with die pad in semiconductor package2017 9,780,069'Semiconductor device'2017 9,640,455'Semiconductor device'2017 9,520,374'Semiconductor device, substrate and semiconductor device manufacturing method'2016 9,502,339'Resin-encapsulated semiconductor device and its manufacturing method'2016 9,355,988'Semiconductor device'2016 9,287,202'Resin-encapsulated semiconductor device and its manufacturing method'2016 8,829,660'Resin-encapsulated semiconductor device'2014 8,810,016'Semiconductor device, substrate and semiconductor device manufacturing method'2014 8,368,234'Semiconductor device, production method for the same, and substrate'2013 8,350,371'Semiconductor device and method of manufacturing semiconductor device'2013 8,115,299'Semiconductor device, lead frame and method of manufacturing semiconductor device'2012 8,039,934'Resin-encapsulated semiconductor device and its manufacturing method'2011 8,022,532'Interposer and semiconductor device'2011 7,923,834'Interposer and semiconductor device'2011 7,902,681'Semiconductor device, production method for the same, and substrate'2011 7,825,498'Semiconductor device'2010 7,608,930'Semiconductor device and method of manufacturing semiconductor device'2009 7,192,870'Semiconductor device and fabrication process therefor'2007 7,095,100'Semiconductor device and method of making the same'2006 6,936,499'Semiconductor device and fabrication process therefor'2005 6,586,832'Semiconductor device and fabrication process thereof'2003

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2003–2020Patents assigned to ROHM CO LTD (33)· patent assignee history

2003–2020Based in Kyoto, JP· patent location history

2012–2014Patents assigned to HAGA MOTOHARU (5)· patent assignee history

2012–2014Patents assigned to KASUYA YASUMASA (5)· patent assignee history

2012–2014Patents assigned to YASUNAGA SHOJI (3)· patent assignee history

2013–2014Patents assigned to MATSUBARA HIROAKI (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
ROHM CO LTD	33	2003–2020
HAGA MOTOHARU	5	2012–2014
KASUYA YASUMASAself	5	2012–2014
YASUNAGA SHOJI	3	2012–2014
MATSUBARA HIROAKI	2	2013–2014

Locations

Location	Patents	Span
Kyoto, JP	34	2003–2020