Circuit and method for measuring capacitance
Granted 15 Apr 2003 · no office action yet
Assignee: Macronix International
Law firm: Law firm · Log in to unlock
Attorney: Attorney · Log in to unlock
Inventors: Tsung-Hsuan Hsieh, Tao-Cheng Lu, Yao-Wen Chang · Examiner: N. Le · AU 2858 · TC 2800
Life of the application
5 dated eventsAbstract
A circuit structure for measuring a capacitive load. The capacitive load is coupled between a first and a second nodes, and drains of a first PMOS and a first NMOS transistors are coupled to the first node, and drains of a second PMOS and a second NMOS transistors are coupled to the second node, and a pad is coupled to the second node. First, sources of the first and the second PMOS transistors and sources of the first and the second NMOS transistors are biased at a power source and a ground respectively. A non-synchronized voltage is applied to gates of the first and the second PMOS transistors and to gates of the first and the second NMOS transistors simultaneously. By grounding and floating the pad, a current flowing through the capacitive load is obtained to calculate the capacitance.
Description
6 parts›CROSS-REFERENCE TO RELATED APPLICATION
This application claims the priority benefit of Taiwan application serial no. 90127831, filed Nov. 9, 2001.
›BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates in general to a circuit and a method for measuring a capacitance, and more particularly relates to a circuit and a method for measuring a capacitance based upon charges.
2. Description of Related Art
Unavoidably, there are capacitors or capacitive loads formed in an integrated circuit (IC). For understanding effects from the capacitors or capacitive loads, it has to precisely measure the capacitances of the capacitors or capacitive loads. FIGS. 1 A˜ 1 C shows a conventional circuit diagram and its corresponding bias conditions for measuring a capacitance of a capacitor. As shown in FIG. 1A, the circuit configuration comprises four MOS (Metal oxide Semiconductor) transistors P 1 , P 2 , N 1 and N 2 , in which the sources of the PMOS transistors P 1 and P 2 are coupled to a power source V DD , and the sources of the NMOS transistors N 1 and N 2 are coupled to a power source GND. By measuring a current flowing through the capacitor C, its capacitance can be determined thereby. The measuring scheme using the above circuit is discussed in brief as follows.
Referring to FIG. 1A, non-synchronized voltages Vp, Vn are respectively applied to the gates of the PMOS transistor P 1 and the NMOS transistor N 1 , and a voltage of V DD is applied to both of the gates of the PMOS transistor P 2 and the NMOS transistor N 2 . Accordingly, a current flows from the PMOS transistor P 1 to the capacitor C to charge the capacitor (current I C1 ). Then, the capacitor C is discharged using a current I through the NMOS transistor N 1 to the ground.
Referring to FIG. 1B, the non-synchronized voltages Vp, Vn are respectively applied to the gates of the PMOS transistor P 2 and the NMOS transistor N 2 , and the voltage of V DD is applied to both of the gates of the PMOS transistor P 1 and the NMOS transistor N 1 . Accordingly, a current flows from the PMOS transistor P 2 to the capacitor C to charge the capacitor (current I C2 ). Then, the capacitor C is discharged using a current I through the NMOS transistor N 2 to the ground.
Next, referring to FIG. 1C, the non-synchronized voltages Vp, Vn are respectively applied to the gates of the PMOS transistor P 1 , P 2 and the NMOS transistor N 1 , N 2 . Then, currents I flow through the NMOS transistors N 1 , N 2 to the ground without flowing through the capacitor C.
A current flowing through the capacitor C can be calculated by adding the currents measured from FIGS. 1A, 1 B and then subtracting the current measured from FIG. 1C, there by the capacitance of the capacitor C can be obtained. However, there are some drawbacks using the circuit above to measure the capacitance. It requires three steps to measure the current through the capacitor, which is complicated and not accurate.
›SUMMARY OF THE INVENTION
According to the foregoing description, it is an object of this invention to provide a circuit for measuring a capacitance and a capacitance measuring method based upon the circuit, thereby the capacitance can be fast and accurately measured.
It is another object of this invention to provide a circuit for measuring a capacitance for reducing the pad number of the circuit and therefore simplifying its fabricating process.
According to the objects mentioned above, the invention provides a circuit for measuring a capacitance of a capacitive load. The circuit comprises elements as follows. A first type- 1 MOS transistor (for example a PMOS transistor) has a source coupled to a first power source (for example V DD ). A second type-1 MOS transistor has a source coupled to a second power source, and a first input voltage that is applied to the gates of the first and the second type-1 MOS transistor. A first type-2 MOS transistor (for example a NMOS transistor) has a source coupled to a third power source having a level lower than the first power source (for example a ground level), and the drain of the first type-2 MOS transistor is coupled to the drain of the first type-1 MOS transistor. A second type-2 MOS transistor has a source coupled to the third power source, and the drain of the second type-2 MOS transistor is coupled to the drain of the second type-1 MOS transistor, and a second input voltage is applied to the gates of the first and the second type-2 MOS transistor, wherein the first and the second input voltages are non-synchronized. A capacitive load is coupled between the drains of the first and the second type-1 MOS transistors. And a pad is coupled to the drain of the second type-1 MOS transistor, wherein the third power source is applied to the pad such that the voltage at the two ends of the capacitive load are the same for measuring a first output current, and the pad is floated such that the voltage at the two ends of the capacitive load are different for measuring a second output current, and then a current flowing through the capacitive load is obtained by subtracting the first and the second output current. Thus, the capacitance of the capacitive load is calculated.
The invention further provides a circuit for measuring a capacitance of a capacitive load. The circuit comprises elements as follows. A first type-1 MOS transistor (for example a PMOS transistor) has a source coupled to a first power source (for example V DD ). A second type-1 MOS transistor has a source coupled to a second power source, and a first input voltage is applied to the gates of the first and the second type-1 MOS transistor. A first type-2 MOS transistor (for example a NMOS transistor) has a source coupled to a third power source having a level lower than the first power source (for example a ground level), and the drain of the first type-2 MOS transistor is coupled to the drain of the first type-1 MOS transistor. A second type-2 MOS transistor has a source coupled to the third power source, and the drain of the second type-2 MOS transistor is coupled to the drain of the second type-1 MOS transistor, and a second input voltage is applied to the gates of the first and the second type-2 MOS transistor, wherein the first and the second input voltages are non-synchronized. A capacitive load is coupled between the drains of the first and the second type-1 MOS transistors. And a MOS transistor is coupled to the drain of the second type-1 MOS transistor, wherein the MOS transistor is turned on such that the voltage at the two ends of the capacitive load are the same for measuring a first output current, and the MOS transistor is turned off such that the voltage at the two ends of the capacitive load are different for measuring a second output current, and then a current flowing through the capacitive load is obtained by subtracting the first and the second output current. Thus, the capacitance of the capacitive load is calculated.
The invention further provides a method for measuring a capacitive load. The capacitive load is coupled between a first and a second nodes, and drains of a first PMOS and a first NMOS transistors are coupled to the first node, and drains of a second PMOS and a second NMOS transistors are coupled to the second node, and a pad is coupled to the second node. First, a power source is applied to sources of the first and the second PMOS transistors, and a ground is applied to sources of the first and the second NMOS transistors. A first input voltage is applied to gates of the first and the second PMOS transistors and a second input voltage is applied to gates of the first and the second NMOS transistors simultaneously, wherein the first and the second input voltages are non-synchronized.
Then, the ground is applied to the pad such that the voltage at the two ends of the capacitive load are the same for measuring a first output current, and the pad is floating such that the voltage at the two ends of the capacitive load are different for measuring a second output current. By subtracting the first and the second output currents, a capacitor current flowing through the capacitive load is obtained. Thus, the capacitance of the capacitive load is calculated using the capacitor current.
By means of the circuit configuration above, the non-synchronized voltage is applied to both of the gates of the PMOS transistors P 1 , P 2 and NMOS transistors N 1 , N 2 as the circuit of the invention is activated. Therefore, the measurement of the capacitance can be faster and more accurate. Furthermore, for measuring the capacitance, it requires only two steps and therefore, the measuring steps can be reduced and simplified. Moreover, the pad number for the circuit is reduced and accordingly the manufacturing process for the circuit of the invention can be simplified.
›BRIEF DESCRIPTION OF THE DRAWINGS
While the specification concludes with claims particularly pointing out and distinctly claiming the subject matter which is regarded as the invention, the objects and features of the invention and further objects, features and advantages thereof will be better understood from the following description taken in connection with the accompanying drawings in which:
FIGS. 1 A˜ 1 C shows a circuit diagram and bias conditions for measuring a capacitance according to the conventional method;
FIG. 2 shows a schematic circuit diagram for measuring a capacitance according to the embodiment of the invention;
FIG. 3 shows a exemplary waveforms for a non-synchronized input signals; and
FIG. 4 shows another circuit diagram for measuring a capacitance according to the alternative embodiment of the invention.
›DESCRIPTION OF THE PREFERRED EMBODIMENT · 1 of 2
The invention is a circuit configuration for measuring a capacitor load or capacitive load in an integrated circuit based upon a charge-based way. In regard to the circuit configuration, a pass-transistor can be used for replacing one pad to control the circuit. Therefore, the capacitance can be quickly and accurately measured, and furthermore the pad number of the circuit is reduced and the fabricating process is simplified.
FIG. 2 is a schematic circuit diagram for measuring a capacitance according to the embodiment of the invention. Accompanying with FIG. 2, a detail process how to measure a capacitance of a capacitive load using the circuit is described below.
As shown in FIG. 2, the circuit for measuring the capacitance comprises four MOS transistors P 1 , P 2 , N 1 , N 2 and a pad 10 . The sources of the PMOS transistors P 1 , P 2 are coupled to a power source V DD , and the drains of the PMOS transistors P 1 , P 2 are coupled to the drains of the NMOS transistors N 1 , N 2 . The sources of the NMOS transistors N 1 , N 2 are coupled to a ground level GND. For convenience, a node n 1 is defines as the connection of the drains of the PMOS transistor P 1 and the NMOS transistor N 1 , and a node n 2 is defines as the connection of the drains of the PMOS transistor P 2 and the NMOS transistor N 2 .
The pad 10 is connected to the node n 2 for control the operation of the circuit by applying suitable voltages. Additionally, the gates of the PMOS transistors P 1 , P 2 are connected together to an input voltage Vp, while both the gates of the NMOS transistors N 1 , N 2 are connected to an input voltage Vn. These two input voltage are termed a non-synchronized voltage. Furthermore, a capacitive load C is coupled between the nodes n 1 and n 2 .
FIG. 3 shows an example of the non-synchronized voltage comprising input voltages Vp, Vn respectively applied to the gates of the PMOS transistors P 1 , P 2 and the gates of the NMOS transistors N 1 , N 2 . As shown, the input voltage Vp is high (V DD ) from time t 0 to t 3 , while the input voltage Vn is high from time t 1 to t 2 . Namely, the status transience of the voltage Vp, Vn is not occurred at the same time. The operation for circuit in FIG. 2 is described in detail below.
Referring to FIG. 2, each of the MOS transistors is properly biased. Namely, the sources of the sources of the PMOS transistors P 1 , P 2 are coupled to a power source V DD , and the sources of the NMOS transistors N 1 , N 2 are coupled to a ground level GND. Additionally, of the non-synchronized voltage, the input voltage Vp is applied to the gates of the PMOS transistors P 1 , P 2 , while the input voltage Vn is applied to the gates of the NMOS transistors N 1 , N 2 (Vp and Vn can be the waveform in FIG. 3 for example).
At this time, the PMOS transistors P 1 , P 2 are off during time t 0 ˜t 3 . The NMOS transistors N 1 , N 2 are on during time t 1 ˜t 2 , and are off during time t 0 ˜t 1 and t 2 ˜t 3 . Therefore, during time t 1 ˜t 2 , the PMOS transistors P 1 , P 2 are off and the NMOS transistors N 1 , N 2 are on, thereby the voltages at the nodes n 1 , n 2 are all pulled down to the ground level GND because the NMOS transistors N 1 , N 2 are on.
The pad 10 is then connected to the ground level GND. Because the pad 10 is connected to the node n 2 , and the node n 2 is pulled down to the ground level GND. Therefore, the voltages at the nodes n 1 , n 2 are the same, the ground level GND. Therefore, no current passes through the capacitive load C, and the currents I flow through the turned on NMOS transistors N 1 , N 2 . Thus, an output current of 21 is measured.
The pad 10 is then floating, and therefore the voltage at the node n 2 is determined by the status of the PMOS transistor P 2 and the NMOS transistor N 2 . For example, when the PMOS transistor P 2 is on and the NMOS transistor N 2 is off, the voltage at the node n 2 is pulled up to V DD . Conversely, when the PMOS transistor P 2 is off and the NMOS transistor N 2 is on, the voltage at the node n 2 is pulled up to the ground level GND. Accordingly, when the pad 10 is floating, the voltages at the nodes n 1 , n 2 are different and then a current I C flows through the capacitive load C, charging the capacitor C. The capacitor C then discharged through the NMOS transistors N 1 , N 2 with current 1 . Thus, an output current of 2I+I C is measured.
Thereafter, by subtracting the two measured output currents, the current I C through the capacitive load C can be obtained. The capacitance of the capacitor C can be calculated using the current I C and the voltage drop between the nodes n 1 , n 2 .
FIG. 4 shows another circuit diagram for measuring a capacitance according to the alternative embodiment of the invention. A pass transistor is used for replacing the pad in FIG. 3 .
As shown in FIG. 4, for example, the pass transistor Q is a NMOS transistor, wherein the drain is connected to the drains (node n 2 ) of the PMOS transistor P 1 and the NMOS transistor N 2 , and the source is connected to the ground GND. The operation for measuring the capacitance in FIG. 4 is the same as that in FIG. 2 .
As the foregoing description, applying VDD to the gate of the pass transistor is equivalent to the condition that the pad 10 in FIG. 2 is connected to the ground level GND to pull down the voltage at the node n 2 . The NMOS transistor Q is then turned on and the voltage at the node n 2 is connected to the ground, thereby the voltages at the nodes n 1 , n 2 are the same. Additionally, applying the ground level GND to the gate of the pass transistor Q is equivalent to the condition that the pad 10 in FIG. 2 is floating to pull up the voltage at the node n 2 (when the PMOS transistor P 2 is on) to V DD , or pull down the voltage at the node n 2 (when the NMOS transistor N 2 is on) to the ground GND. Accordingly, the NMOS transistor Q is turned off and the voltages at the nodes n 1 , n 2 are different, resulting in that a current flows through the capacitive load and charges the capacitive load.
›DESCRIPTION OF THE PREFERRED EMBODIMENT · 2 of 2
Namely, the embodiment uses a transistor switch to achieve grounding or floating the pad 10 in FIG. 2, thereby a current flowing through the capacitive load is measured to calculate the capacitance. As for the detail measuring process, it is the same as the previous embodiment, and no detail description is doubled here.
In the second embodiment, an NMOS transistor is the pass transistor Q as an example. However, for those skilled in the art, the NMOS transistor can be replaced by a PMOS transistor and the corresponding bias condition is changed accordingly.
In summary, comparing with the conventional method and circuit, the non-synchronized voltage is applied to both of the gates of the PMOS transistors P 1 , P 2 and NMOS transistors N 1 , N 2 as the circuit of the invention is activated. It is not necessary to apply the non-synchronized voltage to the gates of the MOS transistors three times as described in the conventional circuit in FIGS. 1 A˜ 1 C. Therefore, the measurement of the capacitance can be faster and more accurate.
Furthermore, according to the invention, for measuring the capacitance, it requires only two steps to apply suitable bias to the pad in FIG. 2 or to the gate of the pass-transistor in FIG. 4 . Therefore, the measuring steps can be reduced and simplified.
Moreover, according to the circuit configuration of the invention, the total pad number is reduced. In regard to the conventional circuit in FIG. 1A, it requires seven pads: two for the power source VDD, four for the gates of the MOS transistors and one for the ground. Conversely, according to the present invention, it requires only six pads: two for the power source VDD, two for the gates of the MOS transistors (because the gates of the PMOS and NMOS transistors share the same pad) for receiving the non-synchronized voltage, one for the ground, and one for the pad. Therefore, the manufacturing process for the circuit of the invention can be simplified.
While the present invention has been described with a preferred embodiment, this description is not intended to limit our invention. Various modifications of the embodiment will be apparent to those skilled in the art. It is therefore contemplated that the appended claims will cover any such modifications or embodiments as fall within the true scope of the invention.
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3 codes- G01R27/26
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