Retaining ring for substrate
Granted 21 Mar 2023 · no office action yet
Assignee: Ebara Corporation
Law firm: Law firm · Log in to unlock
Attorney: Attorney · Log in to unlock
Inventors: Kenichi Akazawa, Osamu Nabeya · Examiner: Calvin E Vansant · AU 2915 · TC 2900
Life of the application
5 dated eventsDescription
1 parts›1. Retaining ring for substrate 1 . 1…
1. Retaining ring for substrate
1 . 1 : Perspective
1 . 2 : Perspective
1 . 3 : Bottom
1 . 4 : Top
1 . 5 : Front
1 . 6 : Cross sectional
1 . 7 : Cross sectional
1 . 8 : Cross sectional
This article is used to hold a substrate in a ring and polish one side of the substrate during the polishing process of wafers and other substrates in the manufacture of semiconductors and other products; the rear view, right side view, and left side view are all represented identically to the front view.
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