Inventor
OSAMU NABEYA
Inventor
JP
Overview
Patents· 21 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing35%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1029%
H01LSemiconductor devices18%
LOC136%
B29CShaping or joining of plastics2%
F17DPipe-line systems2%
G06FElectric digital data processing2%
G06NComputing arrangements based on specific computational models2%
LOC152%
Y10TTechnical subjects covered by former us classification2%
PatentTitleYear
12,381,089Information processing system, information processing method, program, and substrate processing apparatus202512,358,096Rubber membrane having first and second hardness for use in a polishing head202512,337,438Break-in processing apparatus and break-in processing method202512,230,529Substrate holding apparatus, substrate suction determination method, substrate polishing apparatus, substrate polishing method, method of removing liquid from upper surface of wafer to be polished, elastic film for pressing wafer against polishing pad, substrate release method, and constant amount gas supply apparatus202512,183,642Film-thickness measuring method, method of detecting notch portion, and polishing apparatus202412,128,523Polishing apparatus202412,068,189Elastic membrane, substrate holding device, and polishing apparatus202411,958,163Substrate holding apparatus, elastic membrane, polishing apparatus, and method for replacing elastic membrane2024D1021832Elastic membrane202411,752,590Polishing head and polishing apparatus202311,745,306Polishing apparatus and method of controlling inclination of stationary ring202311,731,235Polishing apparatus and polishing method2023D0989012Elastic membrane202311,654,524Method of detecting abnormality of a roller which transmits a local load to a retainer ring, and polishing apparatus2023D0981969Elastic membrane for semiconductor wafer polishing apparatus2023D0981459Retaining ring for substrate202311,478,895Substrate holding device, substrate polishing apparatus, and method of manufacturing the substrate holding device202211,472,000Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus202211,426,834Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method202211,224,956Polishing apparatus202211,179,823Substrate holding apparatus, elastic membrane, polishing apparatus, and method for replacing elastic membrane2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to EBARA CORP (21)· patent assignee history
2021–2025Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| EBARA CORP | 21 | 2021–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 21 | 2021–2025 |