Grounding ring of a process kit for semiconductor substrate processing
Granted 25 Feb 2025 · no office action yet
Current assignee: Applied Materials Israel · originally Applied Materials, Inc.
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Inventors: Qanit Takmeel, Harisha Sathyanarayana, Diego Ramiro Puente Sotomayor, Edwin C. Suarez +4 · Examiner: Nicole C Shiflet · AU 2935 · TC 2900
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4 dated eventsDescription
1 parts›FIG. 1 is a top isometric view of…
FIG. 1 is a top isometric view of a grounding ring of a process kit for semiconductor substrate processing, according to the novel design.
FIG. 2 is a bottom isometric view thereof.
FIG. 3 is a top plan view thereof.
FIG. 4 is a bottom plan view thereof.
FIG. 5 is a left elevation view thereof.
FIG. 6 is a right elevation view thereof.
FIG. 7 is a back elevation view thereof, enlarged to more clearly show details; and,
FIG. 8 is a front elevation view thereof, enlarged to more clearly show details.
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