USPatentGranted

Grounding ring of a process kit for semiconductor substrate processing

Granted 25 Feb 2025 · no office action yet

Current assignee: Applied Materials Israel · originally Applied Materials, Inc.

Inventors: Qanit Takmeel, Harisha Sathyanarayana, Diego Ramiro Puente Sotomayor, Edwin C. Suarez +4 · Examiner: Nicole C Shiflet · AU 2935 · TC 2900

Application

29/848,745

filed 4 Aug 2022

Publication

Not published

not published

Patent· this page

US D1064005

granted 25 Feb 2025

term adjustment not held

none

Litigation

checked

Classifications

Citations

55 cites · 0 cited by

Owners

1 recorded conveyances

Life of the patent

4 dated events

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Description

1 parts

›FIG. 1 is a top isometric view of…

FIG. 1 is a top isometric view of a grounding ring of a process kit for semiconductor substrate processing, according to the novel design.

FIG. 2 is a bottom isometric view thereof.

FIG. 3 is a top plan view thereof.

FIG. 4 is a bottom plan view thereof.

FIG. 5 is a left elevation view thereof.

FIG. 6 is a right elevation view thereof.

FIG. 7 is a back elevation view thereof, enlarged to more clearly show details; and,

FIG. 8 is a front elevation view thereof, enlarged to more clearly show details.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims

1 · 1 independent · depth 1

1 granted claims

›1.independentThe ornamental design for a grounding ring of a process kit for semiconductor substrate processing, as shown and described.

Classifications

2 codes

USPC · US Patent Classification

D15/138D13/182

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File wrapper

Pendency

2.6 y

936 days filing → grant

Office actions

on the grant's record

Examiner

Nicole C Shiflet

art unit 2935 · TC 2900

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Citations: 55 back · 0 forward

Chain of title

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Worldwide family

3 members · 3 offices

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Members

DOCDB simple family 86900403

Offices

US · JP

Granted

2 of 3

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Non-English titles

shown as filed, never translated

›IP5 & PCT — 2 members

Office	Publication	Kind	Published	Filed	Status	Title
USthis patent	US-D1064005-S	S1	25 Feb 2025	4 Aug 2022	granted	Grounding ring of a process kit for semiconductor substrate processing
JP	JP-1747764-S	S	30 Jun 2023	6 Feb 2023	granted	半導体基板処理のための処理キットの接地リングja

›Other offices — 1 members

Office	Publication	Kind	Published	Filed	Status	Title
TW	TW-D227852-S	S	1 Oct 2023	3 Feb 2023	published	用於半導體基板處理的處理套組之接地環zh

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