Elastic membrane for semiconductor wafer polishing apparatus

FIG. 1 is a top perspective view a first embodiment of an elastic membrane for semiconductor wafer polishing apparatus showing our new design;

FIG. 2 is a bottom perspective view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a side view thereof, with the apparatus being radially symmetrical about a vertical axis;

FIG. 6 is a cross sectional view taken along section line 6 - 6 in FIG. 3 ;

FIG. 7 is an enlarged portion view taken along line 7 - 7 in FIG. 6 ;

FIG. 8 is a top perspective view a second embodiment of an elastic membrane for semiconductor wafer polishing apparatus showing our new design;

FIG. 9 is a bottom perspective view thereof;

FIG. 10 is a top plan view thereof;

FIG. 11 is a bottom plan view thereof;

FIG. 12 is a side view thereof, with the apparatus being radially symmetrical about a vertical axis;

FIG. 13 is a cross sectional view taken along section line 13 - 13 in FIG. 10 ;

FIG. 14 is an enlarged portion view taken along line 14 - 14 in FIG. 13 ;

FIG. 15 is a top perspective view a third embodiment of an elastic membrane for semiconductor wafer polishing apparatus showing our new design;

FIG. 16 is a bottom perspective view thereof;

FIG. 17 is a top plan view thereof;

FIG. 18 is a bottom plan view thereof;

FIG. 19 is a side view thereof, the apparatus being radially symmetrical about a vertical axis;

FIG. 20 is a cross sectional view taken along section line 20 - 20 in FIG. 17 ;

FIG. 21 is an enlarged portion view taken along line 21 - 21 in FIG. 20 ;

FIG. 22 is a top perspective view a fourth embodiment of an elastic membrane for semiconductor wafer polishing apparatus showing our new design;

FIG. 23 is a bottom perspective view thereof;

FIG. 24 is a top plan view thereof;

FIG. 25 is a bottom plan view thereof;

FIG. 26 is a side view thereof, the apparatus being radially symmetrical about a vertical axis;

FIG. 27 is a cross sectional view taken along line 27 - 27 in FIG. 24 ; and,

FIG. 28 is an enlarged portion view taken along line 28 - 28 in FIG. 27 .

The broken lines shown in the drawings represent portions of the elastic membrane for semiconductor wafer polishing apparatus that form no part of the claimed design.