USPatent applicationPatented

Load-lock chamber

Granted 27 Nov 2007 · no office action yet

Application· this page
29/217,730
filed 22 Nov 2004
Publication
Not published
not published
Patent
US D556157
granted 27 Nov 2007

Life of the application

5 dated events
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Description

1 parts
›The present article relates to a load-lock chamber…

The present article relates to a load-lock chamber for a multi-chamber type semiconductor substrate processing apparatus for a film forming process and other processes for semiconductor substrates, and others to be processed. The load-lock chamber is, as shown in a reference drawing illustrating a state of usage of the load-lock chamber, connected to a transfer-chamber wherein load-in and load-out of substrates to be processed are carried out without exposing the transfer-chamber to air.

FIG. 1 is a top view of the load-lock chamber,

FIG. 2 is a front elevational view thereof;

FIG. 3 is a back elevational view thereof;

FIG. 4 is a bottom view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a sectional view taken along line 7 - 7 in FIG. 1 ;

FIG. 8 is a perspective view thereof; and,

FIG. 9 is a reference figure showing a bottom perspective view thereof.

The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims as granted

1 claim

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Classifications

1 codes
USPC · US Patent Classification
D13/182

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File wrapper

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Pendency
3.0 y
1,100 days filing → grant
Office actions
0
none on record
Examiner
Selina Sikder
art unit 2912 · TC 2900
Citations: 9 back · 0 forward

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Documents

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Chain of title

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